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Publication Citation: Laser Ultrasound: An Inspection Tool of Soft Porous Low-Dielectric Constant Films for Microelectronic Interconnect

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Author(s): Colm Flannery; Donna C. Hurley;
Title: Laser Ultrasound: An Inspection Tool of Soft Porous Low-Dielectric Constant Films for Microelectronic Interconnect
Published: March 01, 2003
Abstract: The demand for miniaturization in the microelectronics industry requires that the RC (Resistance-Capacitance) factor be lowered to reduce interconnection delay, crosstalk and power loss. The most promising way to achieve this is by introducing porosity into the dielectric film material. We show that laser-generated surface acoustic waves can successfully and rapidly characterize porosity/density and stiffness of these films. Complementary measurements from X-ray reflectivity and Brillouin light scattering verify our results. We discuss why nanoindentation presents difficulties.
Conference: AIP Conference Proceedings
Proceedings: Review of Progress in Quantitative Nondestructive Evaluation | | Review of Progress in Quantitative Nondestructive Evaluation, Volume 22 | AIP
Volume: 657
Pages: pp. 1463 - 1470
Dates: July 14-19, 2002
Keywords: laser ultrasonics;low K materials;porous films
Research Areas: Nanomaterials
PDF version: PDF Document Click here to retrieve PDF version of paper (170KB)