Take a sneak peek at the new NIST.gov and let us know what you think!
(Please note: some content may not be complete on the beta site.).
NIST Authors in Bold
|Author(s):||Colm Flannery; Donna C. Hurley;|
|Title:||Laser Ultrasound: An Inspection Tool of Soft Porous Low-Dielectric Constant Films for Microelectronic Interconnect|
|Published:||March 01, 2003|
|Abstract:||The demand for miniaturization in the microelectronics industry requires that the RC (Resistance-Capacitance) factor be lowered to reduce interconnection delay, crosstalk and power loss. The most promising way to achieve this is by introducing porosity into the dielectric film material. We show that laser-generated surface acoustic waves can successfully and rapidly characterize porosity/density and stiffness of these films. Complementary measurements from X-ray reflectivity and Brillouin light scattering verify our results. We discuss why nanoindentation presents difficulties.|
|Conference:||AIP Conference Proceedings|
|Proceedings:||Review of Progress in Quantitative Nondestructive Evaluation | | Review of Progress in Quantitative Nondestructive Evaluation, Volume 22 | AIP|
|Pages:||pp. 1463 - 1470|
|Dates:||July 14-19, 2002|
|Keywords:||laser ultrasonics,low K materials,porous films|
|PDF version:||Click here to retrieve PDF version of paper (170KB)|