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|Author(s):||Thomas A. Siewert; C A. Handwerker;|
|Title:||Test Procedures for Developing Solder Data|
|Published:||August 01, 2002|
|Abstract:||This publication documents standardized test procedures that can produce valid and reproducible mechanical property data for lead-free solders. Such data speeds the application of lead-free solders in high-volume, automated production of electronic assemblies, especially when current production expectations combine high levels of quality with the lowest cost. Use of standardized procedures facilitates the comparison of data between laboratories, and permits the combination of data from different sources into a single, comprehensive database.|
|Citation:||Special Publication (NIST SP) - 960-8|
|Keywords:||electronics assembly,lead-free alloys,mechanical testing,property data,solder,standardized procedures,test procedures|
|PDF version:||Click here to retrieve PDF version of paper (650KB)|