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|Author(s):||T W. Hwang; Christopher J. Evans; S Malkin;|
|Title:||An Investigation of High Speed Grinding With Electroplated Diamond Wheels|
|Published:||August 01, 2000|
|Abstract:||An investigation was undertaken to evaluate the effect of high wheel speeds for grinding of silicon nitride ceramic with electroplated diamond wheels. Straight surface grinding experiments were conducted at wheel speeds of 85 m/s and 149 m/s using the same removal rate. Measurements are reported for the grinding forces, radial wheel wear, and surface roughness throughout the useful wheel life, and for the flexure strength after grinding. Although the forces tended to be somewhat lower at the higher wheel speed, the grinding performance was not necessarily better when compared in terms of wheel wear, surface roughness, and strength degradation. Preliminary measurements of acoustic emission illustrate possibilities for process monitoring.|
|Citation:||Cirp Annals-Manufacturing Technology|
|Research Areas:||Metrology and Standards for Manufacturing Processes|