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Publication Citation: Optical Flatness Metrology for 300 mm Silicon Wafers

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Author(s): Ulf Griesmann; Quandou Wang; T D. Raymond;
Title: Optical Flatness Metrology for 300 mm Silicon Wafers
Published: April 01, 2005
Abstract: At the National Institute of Standards and Technology (NIST), we are developing two interferometric methods for measuring the thickness variation and flatness of free-standing and chucked silicon wafers with diameters up to 300mm. The eXtremely accurate CALIBration InterferometeR (XCALIBIR) is a precision phase measuring interferometer with an operating vacelength of 633nm and a test beam of 300 mm diameter. XCALIBIR is used to evaluate the flatness of chucked wafers. NIST''s infrared interferometer (IR2) is a phase measuring interferometer that operates at 1.55um and is used to measure the thickness variation of free-standing 300 mm silicon wafers.
Conference: American Institute of Physics Conference on Characterization and Metrology for ULSI Technology
Proceedings: American Institute of Physics Proceedings of the 2005 Conference on Characterization and Metrology for ULSI Technology
Volume: 788
Pages: pp. 599 - 603
Location: Dallas, TX
Dates: March 15-28, 2005
Keywords: 300mm silicon wafers;wafer flatness;wafer thickness variation (TTV and GBIR)
Research Areas: Nanomanufacturing
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