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NIST Authors in Bold
|Author(s):||Ulf Griesmann; Quandou (. Wang; T D. Raymond;|
|Title:||Optical Flatness Metrology for 300 mm Silicon Wafers|
|Published:||April 01, 2005|
|Abstract:||At the National Institute of Standards and Technology (NIST), we are developing two interferometric methods for measuring the thickness variation and flatness of free-standing and chucked silicon wafers with diameters up to 300mm. The eXtremely accurate CALIBration InterferometeR (XCALIBIR) is a precision phase measuring interferometer with an operating vacelength of 633nm and a test beam of 300 mm diameter. XCALIBIR is used to evaluate the flatness of chucked wafers. NIST''s infrared interferometer (IR2) is a phase measuring interferometer that operates at 1.55um and is used to measure the thickness variation of free-standing 300 mm silicon wafers.|
|Conference:||American Institute of Physics Conference on Characterization and Metrology for ULSI Technology|
|Proceedings:||American Institute of Physics Proceedings of the 2005 Conference on Characterization and Metrology for ULSI Technology|
|Pages:||pp. 599 - 603|
|Dates:||March 15-28, 2005|
|Keywords:||300mm silicon wafers,wafer flatness,wafer thickness variation (TTV and GBIR)|
|PDF version:||Click here to retrieve PDF version of paper (531KB)|