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|Author(s):||Richard A. Allen; Janet M. Cassard; Winthrop A. Baylies; David T. Read; George D. Quinn; Frank W. DelRio; Kevin T. Turner; Michael Bernasch; Joerg Bagdahn;|
|Title:||A Standard Method for Measuring Wafer Bond Strength for MEMS Applications|
|Published:||December 23, 2008|
|Abstract:||A round robin, to provide precision and bias data for SEMI standard MS5-1107, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures, in underway. The precision and bias data, combined with experience in applying the test instructions included in MS5-1107, will provide the basis for an updated version of MS5. Measurements at the pilot lab have been completed and the round robin is on-going at six additional laboratories.|
|Conference:||Proc. ECS: E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications|
|Pages:||pp. 449 - 455|
|Dates:||October 12-18, 2008|
|Keywords:||micro-chevron, wafer bond strength measurement, SEMI MS5|
|PDF version:||Click here to retrieve PDF version of paper (245KB)|