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Publication Citation: A Standard Method for Measuring Wafer Bond Strength for MEMS Applications

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Author(s): Richard A. Allen; Janet M. Cassard; Winthrop A. Baylies; David T. Read; George D. Quinn; Frank W. DelRio; Kevin T. Turner; Michael Bernasch; Joerg Bagdahn;
Title: A Standard Method for Measuring Wafer Bond Strength for MEMS Applications
Published: December 23, 2008
Abstract: A round robin, to provide precision and bias data for SEMI standard MS5-1107, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures, in underway. The precision and bias data, combined with experience in applying the test instructions included in MS5-1107, will provide the basis for an updated version of MS5. Measurements at the pilot lab have been completed and the round robin is on-going at six additional laboratories.
Conference: Proc. ECS: E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Volume: 16
Issue: 8
Pages: pp. 449 - 455
Location: Honolulu, HI
Dates: October 12-18, 2008
Keywords: micro-chevron; wafer bond strength measurement; SEMI MS5
Research Areas: Semiconductors
PDF version: PDF Document Click here to retrieve PDF version of paper (245KB)