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Publication Citation: A High-Speed Thermal Imaging System for Semiconductor Device Analysis

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Author(s): Allen R. Hefner Jr.; David W. Berning; David L. Blackburn; Christophe C. Chapuy; Sebastien Bouche;
Title: A High-Speed Thermal Imaging System for Semiconductor Device Analysis
Published: April 01, 2001
Abstract: A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument graphical user interface software that controls an infrared thermal microscope, translation stages, digitizing oscilloscope, and a device test fixture temperature controller. The computer interface consists of a front panel for viewing the temperature distribution and includes a movie play back feature that enables viewing of the temperature distribution versus time. The computer user interface also has a sub-panel for emissivity mapping and calibration of the infrared detector. The utility of the system is demonstrated in this paper using a bipolar transistor hotspot current constriction process.
Proceedings: Proc., Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Pages: pp. 43 - 49
Location: San Jose, CA
Dates: March 20-22, 2001
Keywords: infrared thermal measurement,semiconductor device heating,transient thermal image
Research Areas: Electronics & Telecommunications
PDF version: PDF Document Click here to retrieve PDF version of paper (2MB)