Take a sneak peek at the new NIST.gov and let us know what you think!
(Please note: some content may not be complete on the beta site.).
NIST Authors in Bold
|Author(s):||Allen R. Hefner Jr.; David W. Berning; David L. Blackburn; Christophe C. Chapuy; Sebastien Bouche;|
|Title:||A High-Speed Thermal Imaging System for Semiconductor Device Analysis|
|Published:||April 01, 2001|
|Abstract:||A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument graphical user interface software that controls an infrared thermal microscope, translation stages, digitizing oscilloscope, and a device test fixture temperature controller. The computer interface consists of a front panel for viewing the temperature distribution and includes a movie play back feature that enables viewing of the temperature distribution versus time. The computer user interface also has a sub-panel for emissivity mapping and calibration of the infrared detector. The utility of the system is demonstrated in this paper using a bipolar transistor hotspot current constriction process.|
|Proceedings:||Proc., Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium|
|Pages:||pp. 43 - 49|
|Location:||San Jose, CA|
|Dates:||March 20-22, 2001|
|Keywords:||infrared thermal measurement,semiconductor device heating,transient thermal image|
|Research Areas:||Electronics & Telecommunications|
|PDF version:||Click here to retrieve PDF version of paper (2MB)|