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Interconnect and Packaging Metrology Information at NIST

(the links below are a compilation of programs and projects, news/events, and other pages tagged with this term)

2000_presentations (10/07/2011)

2003_presentations (12/15/2011)

2005_presentations (10/07/2011)

2009 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (04/23/2013)

2009 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, 2009 Presentations (10/23/2012)

2011 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, 2011 Presentations (10/07/2011)

CNST and Sandia Researchers Publish a Detailed Review of Electrical Contacts in One and Two Dimensional Nanomaterials (02/15/2012)

FCMN, 2007 Presentations (10/07/2011)

FCMN, Publications and Talks (04/01/2013)

Frontiers of Characterization and Metrology for Nanoelectronics, Past Conferences (03/14/2013)

Laying the Groundwork for 3D Stacked Integrated Circuits (02/27/2012)

NIST Team Reports Method to Characterize New Insulating Materials for Microelectronics (12/13/2012)

Thin Film and Interconnect Reliability (01/04/2013)