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981. Topography Measurements and Applications
Topic: Manufacturing
Published: 1/1/2006
Authors: Jun-Feng Song, Theodore Vincent Vorburger
Abstract: Based on auto- and cross-correlation functions (ACF and CCF), a new surface parameter called profile (or topography) difference, Ds, has been developed for quantifying differences between 2D profiles or between 3D topographies with a single number. & ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=823205

982. Topography Measurements for Determining the Decay Factors in Surface Replication
Topic: Manufacturing
Published: 7/4/2008
Authors: Jun-Feng Song, P Rubert, Xiaoyu A Zheng, Theodore Vincent Vorburger
Abstract: The electro-forming technique is used at National Institute of Standards and Technology (NIST) for the production of standard reference material (SRM) 2461 standard casings to support nationwide ballistics measurement traceability and measurement q ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=823226

983. Toward Accurate Linewidth Metrology Using Atomic Force Microscopy and Tip Characterization
Topic: Manufacturing
Published: 5/1/1996
Authors: Ronald G Dixson, J Schneir, T Mcwaid, N. Sullivan, V W. Tsai, S Zaidi, S Brueck
Abstract: As the critical dimensions of integrated circuit features decrease toward 0.18 um, feature width measurements with nanometer level accuracy will become increasingly important to the semiconductor processing industry. Atomic force microscopy (AFM) off ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=820788

984. Toward Accurate Measurements of Pitch, Height, and Width Artifacts with the NIST Calibrated AFM
Topic: Manufacturing
Published: 1/1/1996
Authors: Ronald G Dixson, Theodore Vincent Vorburger, P Sullivan, V W. Tsai, T Mcwaid
Abstract: Atomic force microscope (AFM) measurements are being used increasingly for metrological applications such as semiconductor process development and control. Common types of measurements are those of feature spacing (pitch), feature height (or depth), ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=820790

985. Toward Nanometer Accuracy Measurements
Topic: Manufacturing
Published: 6/1/1999
Authors: John A Kramar, E Amatucci, David E. Gilsinn, Jay Shi Jun, William B. Penzes, Fredric Scire, E Clayton Teague, John S Villarrubia
Abstract: We at NIST are building a metrology instrument called the Molecular Measuring Machine (MMM) with the goal of performing 2D point-to-point measurements with one nanometer accuracy cover a 50 mm by 50 mm area. The instrument combines a scanning tunneli ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=820933

986. Toward Smart Manufacturing Using Decision Guidance Analytics
Topic: Manufacturing
Published: 11/1/2014
Authors: Alexander Brodsky, Mohan Krishnamoorthy, Daniel A Menasce , Guodong Shao, Sudarsan Rachuri
Abstract: This paper is focused on decision analytics for smart manufacturing. We consider temporal manufacturing processes with stochastic throughput and inventories. We demonstrate the use of the recently proposed concept of the decision guidance analytics l ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=917235

987. Toward Traceability for At Line AFM Dimensional Metrology
Topic: Manufacturing
Published: 1/1/2002
Authors: Ronald G Dixson, Angela Guerry, Marylyn H. Bennett, Theodore Vincent Vorburger, Michael T Postek
Abstract: The in-line and at-line measurement tools for critical dimension (CD) metrology in semiconductor manufacturing are technologically advanced instruments that exhibit excellent measurement repeatability--below 1 nm in some cases. Accuracy, however, is ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=823148

988. Toward Traceability for At-line AFM Dimensional Metrology
Topic: Manufacturing
Published: 7/1/2003
Authors: Marylyn H. Bennett, Angela Guerry, Ronald G Dixson, Michael T Postek, Theodore Vincent Vorburger
Abstract: The in-line and at-line measurement tools for critical dimension (CD) metrology in semiconductor manufacturing are technologically advanced instruments that exhibit excellent measurement repeatability - below one nanometer in some cases. Accuracy, ho ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=821740

989. Toward a Unified Advanced CD-SEM Specification for Sub 0.18 Micrometer Technology
Topic: Manufacturing
Published: 6/1/1998
Authors: J Allgair, C Archie, W Banke, H Bogardus, J Griffith, H Marchman, Michael T Postek, L Saraf, J Schlesinger, B Singh, N. Sullivan, L Trimble, Andras Vladar, A Yanof
Abstract: The stringent critical dimension (CD) control requirements in cutting edge device facilities have placed significant demands on metrologists and upon the tools they use. We are developing a unified, advanced critical dimension scanning electron micro ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=823089

990. Toward the Ideal of Automating Production Optimization
Topic: Manufacturing
Published: 11/15/2013
Authors: John L Michaloski, Frederick M Proctor, Jorge Arinez, Jonatan Berglund
Abstract: The advent of improved factory data collection offers a prime opportunity to continuously study and optimize factory operations. Although manufacturing optimization tools can be considered mainstream technology, most U.S. manufacturers do not take fu ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914707



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