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Topic: Manufacturing
Published: 11/30/2007
Authors: James Paul Randa, Ken Wong, Roger Pollard
Abstract: Results are presented for simulations of a verification process for noise-parameter measurements. The verification process consists of first measuring separately both a passive device and the amplifier or transistor of interest (the DUT) and then mea ...

942. SPM-Based Lithography for Electronics Device Fabrication: New Strategies and Directions
Topic: Manufacturing
Published: 1/1/1995
Author: John A. Dagata
Abstract: Direct patterning of a semiconductor surface to produce an ultrathin oxide mask has proven to be a promising approach for integrating lithographic methods based on scanned probe microscopy (SPM) into existing electronics device processing. The result ...

943. SRM 2460/2461 Standard Bullets and Casings Project
Topic: Manufacturing
Published: 7/10/2002
Authors: Jun-Feng Song, Eric Paul Whitenton, David R Kelley, Robert A. Clary, L Ma, Susan M Ballou, M Ols
Abstract: The National Institute of Standards and Technology (NIST) Standard Reference Material (SRM) 2460/2461 standard bullets and casings project will provide support to firearms examiners and to the National Integrated Ballistics Information Network (NIBIN ...

944. STEP - Compliant NC Research: The Search for Intelligent CAD/CAPP/CAM/CNC Integration
Topic: Manufacturing
Published: 5/31/2004
Authors: Xun W. Xu, H Wang, Jian Mao, S T Newman, Thomas Rollin Kramer, Frederick M Proctor, John L Michaloski
Abstract: Since the first generation of NC machine tool was developed in 1950s, there have been many developments, which make today's NC machines completely unrecognisable from their early ancestors. These developments however are now being significantly l ...

945. STEP, XML, and UML: Complementary Technologies
Topic: Manufacturing
Published: 12/15/2004
Authors: Russell S. Peak, Joshua Lubell, Vijay Srinivasan, Stephen C. Waterbury
Abstract: One important aspect of product lifecycle management (PLM)is the computer-sensible representation of product information. Over the past 15 years or so, several languages and technologies have emerged that vary in their emphasis and applicability for ...

946. STEP-OAGIS Harmonization Joint Working Group, PDM Subgroup Interim Report
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 7618
Topic: Manufacturing
Published: 8/27/2009
Authors: Xenia Fiorentini, Rachuri Rachuri
Abstract: In any manufacturing enterprise, there are two types of tools used to create and share product related data across its extended network. The engineering information of the product is created using what is commonly called engineering authoring tool (e ...

947. STEPNC++ - An Effective Tool for Feature-based CAM/CNC
Topic: Manufacturing
Published: 12/1/2009
Authors: John L Michaloski, Thomas Rollin Kramer, Frederick M Proctor, Xun Xu, Sid Venkatesh, David Odendahl
Abstract: This chapter discusses the realization of direct translation of feature-based CAM files into feature-based CNC part program files. The information infrastructure that allows this to happen is STEP-NC, as described by ISO 14649 Parts 10 and 11. Amon ...

948. STR Sequence Analysis for Characterizing Normal, Variant, and Null Alleles
Topic: Manufacturing
Published: 8/1/2011
Authors: Margaret C Kline, Carolyn R Hill, John M Butler, Amy Decker
Abstract: DNA sequence variation is known to exist in and around the repeat region of short tandem repeat (STR) loci used in human identity testing. While the vast majority of STR alleles measured in forensic DNA laboratories worldwide type as ,normalŠ alleles ...

949. Safe Control of Manufacturing Vehicles Research Towards Standard Test Methods
Topic: Manufacturing
Published: 6/28/2012
Authors: Roger V Bostelman, William P Shackleford, Geraldine S Cheok, Kamel Shawki Saidi
Abstract: The National Institute of Standards and Technology's Intelligent Systems Division has been researching several areas leading to safe control of manufacturing vehicles to improve AGV safety standards. The research areas include: - Automated guided ...

950. Scale-Space Analysis of Line Edge Roughness on 193 nm Lithography Test Structures
Topic: Manufacturing
Published: 1/1/2003
Authors: Ndubuisi George Orji, Theodore Vincent Vorburger, Xiaohong Gu, Jayaraman Raja
Abstract: Line edge roughness (LER) is a potential showstopper for the semiconductor industry. As the width of patterned line structures decreases, LER is becoming a non-negligible contributor to resist critical dimension (CD) variation. The International Tech ...

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