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41. Performance Metrics for Evaluating Object and Human Detection and Tracking Systems
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 7972
Topic: Manufacturing
Published: 7/31/2014
Authors: Afzal A Godil, Roger V Bostelman, William P Shackleford, Tsai Hong Hong, Michael O Shneier
Abstract: In this report, we provide an overview of various performance evaluation metrics for object detection and tracking for robot safety applications in smart manufacturing. We present four different types of performance evaluation metrics based on detect ...

42. Safety and Performance Standard Developments for Automated Guided Vehicles
Topic: Manufacturing
Published: 7/23/2014
Authors: Roger V Bostelman, Tsai Hong Hong, Roger D. Eastman
Abstract: The American National Standards Institute/Industrial Truck Standards Development Foundation (ANSI/ITSDF) B56.5 Safety Standard committee for automated guided vehicles (AGVs) has been considering several changes to improve the standard. Of interest t ...

43. Non-destructive Measurement of the Residual Stresses in Copper Through-Silicon Vias using Synchrotron Based Micro-beam X-ray Diffraction
Topic: Manufacturing
Published: 7/1/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Yaw S Obeng, Klaus Hummler, Ruqing Xu
Abstract: In this study, we report a new method for achieving depth resolved determination of the full stress tensor in buried Cu through-silicon vias (TSVs), using synchrotron based X-ray micro-diffraction technique. Two adjacent Cu TSVs were analyzed; on ...

44. The stability of milling: an impact oscillator with delay
Topic: Manufacturing
Published: 6/20/2014
Authors: Matthew A Davies, Tony Schmitz, Timothy J Burns

45. Effects of Temperature on Surface Accumulation and Release of Silica Nanoparticles in an Epoxy Nanocoating Exposed to UV Radiation
Topic: Manufacturing
Published: 6/16/2014
Authors: Chun-Chieh Tien, Ching-Hsuan Chang, Bernard Hao-Chih Liu, Deborah L Stanley, Savelas A Rabb, Lee Lijian Yu, Tinh Nguyen, Li Piin Sung
Abstract: Polymer nanocoatings are increasingly used outdoors and in harsh environments. However, because most common polymers degraded by the weathering elements, nanoparticles in polymer nanocoatings may be released into the environments. Such nanoparticle r ...

46. Defect and Microstructural Evolution in Thermally Cycled Cu Through-Silicon Vias
Topic: Manufacturing
Published: 6/14/2014
Authors: Chukwudi Azubuike Okoro, James Marro, Yaw S Obeng, Kathleen Richardson
Abstract: In this study, the effect of thermal cycling on defect generation, microstructure, and the RF signal integrity of blind Cu through-silicon via (TSV) were investigated. Three different thermal cycling profiles were used; each differentiated by their ...

47. Uncertainty in Measurement of the Maximum Cutting Tool Temperature by Infrared Thermography
Topic: Manufacturing
Published: 6/13/2014
Authors: Brandon M Lane, Eric Paul Whitenton, Viswanathan Madhavan, M Alkan Donmez
Abstract: This paper presents an analysis of the uncertainty in measurement of the peak temperature on the side face of a cutting tool by infrared thermography. An analytical method uses the temperature measurement equation to study the uncertainty arising f ...

48. BPMN Profile for Operational Requirements
Topic: Manufacturing
Published: 6/2/2014
Authors: Conrad E Bock, Raphael Barbau, Anantha Narayanan Narayanan
Abstract: An important aspect of systems and products is how they interact with their environment, including how they are operated. Behaviors external to systems usually involve people not trained in the details of how systems are designed and built, but who ...

49. Infrared Thermography of the Chip-Tool Interface through Transparent Cutting Tools
Topic: Manufacturing
Published: 6/2/2014
Authors: Thejas T. Menon, Viswanathan Madhavan
Abstract: In-situ observation of the chip-tool interface has been carried out while machining Ti-6Al-4V. A low-noise camera sensitive to visible and near infrared (IR) radiation has been used to record the radiation emitted by the interface, and relatively lon ...

50. X-Ray Micro-Beam Diffraction Measurement of the Effect of Thermal Cycling on Stress in Cu TSV: A Comparative Study
Topic: Manufacturing
Published: 5/26/2014
Authors: Chukwudi Azubuike Okoro, Lyle E Levine, Yaw S Obeng, Klaus Hummler, Ruqing Xu
Abstract: Microelectronic devices are subjected to constantly varying temperature conditions during their operational lifetime, which can lead to their failure. In this study, we examined the impact of thermal cycling on the evolution of stresses in Cu TSVs us ...

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