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Displaying records 21 to 30 of 337 records.
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21. A Standard Source Method for Reducing Antenna Factor Errors in Shielded Room Measurements
Series: Technical Note (NIST TN)
Report Number: 1382
Topic: Electronics & Telecommunications
Published: 3/1/1996
Authors: Dennis G. Camell, Galen H Koepke, R. B. Smith, B. Rakoski

22. A Test Method for Assessing Interfacial Shear Strength in Composites
Topic: Electronics & Telecommunications
Published: 5/1/2000
Authors: Gale Antrus Holmes, Donald Lee Hunston, Walter G McDonough, R C Peterson
Abstract: Two of the critical factors controlling the long-term performance and durability of composites in structural applications is the fiber-matrix interfacial shear strength (IFSS) and the durability of the fiber-matrix interface. The single fiber fragme ...

23. A Transient Response Error in Microwave Power Meters UsingThermistor Detectors
Topic: Electronics & Telecommunications
Published: 12/1/1986
Authors: Fred R. Clague, N T Larsen

24. A four-pixel single-photon pulse-position array fabricated from WSi superconducting nanowire single- photon detectors
Topic: Electronics & Telecommunications
Published: 2/3/2014
Authors: Varun Boehm Verma, Robert D Horansky, Francesco Marsili, Jeffrey Stern, Matthew Shaw, Adriana Eleni Lita, Richard P Mirin, Sae Woo Nam
Abstract: We demonstrate a scalable readout scheme for an infrared single-photon pulse-position camera consisting of WSi superconducting nanowire single-photon detectors. For an N {multiply} N array, only 2 {multiply} N wires are required to obtain the pos ...

25. A quantitative study of the practical sensitivity limit of a terahertz absorption spectrometer.
Topic: Electronics & Telecommunications
Published: 3/18/2008
Authors: Jon E. Bjarnason, Charles Dietlein, Erich N Grossman
Abstract: In gas spectroscopy, chemicals can be identified by the set of frequencies at which their absorption lines occur. The concentration can be quantitatively estimated from the intensity of any of the absorption lines. The sensitivity of the spectrometer ...

26. A statistical study of de-embedding applied to eye diagram analysis
Topic: Electronics & Telecommunications
Published: 2/1/2012
Authors: Paul D Hale, Jeffrey A Jargon, Chih-Ming Wang, Brett Grossman, Matthew Claudius, Jose Torres, Andrew M Dienstfrey, Dylan F Williams
Abstract: We describe a stable method for calibrating digital waveforms and eye diagrams using the measurement system response function and its regularized inverse. The function describing the system response includes the response of the oscilloscope and any ...

27. Absorption, transmission, and scattering of expanded polystyrene at millimeter-wave and terahertz frequencies
Topic: Electronics & Telecommunications
Published: 3/17/2008
Authors: Charles Dietlein, Jon E. Bjarnason, Erich N Grossman, Zoya Popovic
Abstract: Conventional material measurements of transmission and reflection in the millimeter-wave and terahertz frequency range do not differentiate between scattering and absorption, grouping effects from both mechanisms together into 'loss'. Accurate knowle ...

28. Accurate Determination of Planar Near-Field Correction Parameters for Linearly Polarized Probes
Topic: Electronics & Telecommunications
Published: 6/1/1988
Authors: Andrew G. Repjar, Allen C. Newell, Michael H Francis

29. Adhesion Research at the National Institute of Standard and Technology (NIST)
Topic: Electronics & Telecommunications
Published: 3/11/2009
Authors: Donald Lee Hunston, Christopher M Stafford
Abstract: Over the years, NIST has been very active in adhesion research. Although there has never been an organizational group or large-scale program that focused specifically on this topic, a wide variety of projects have had adhesion, or related properties ...

30. Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films
Topic: Electronics & Telecommunications
Published: 10/13/2009
Authors: Ryan Paul Birringer, Roey Shaviv, Thomas Mountsier, Jon Reid, Jian Zhou, Roy H. Geiss, David Thomas Read, Reinhold Dauskardt
Abstract: Effects of the chemistry of electroplated copper films on stress-induced voiding and adhesion between the films and a SiN barrier layer are reported. The void density as observed by scanning electron microscopy decreased markedly with increasing Cu p ...

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