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Author: Yaw Obeng
Displaying records 1 to 10 of 11 records.
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1.
A Case Study on the Impact of Local Material Chemistry on the Mechanical Reliability of Packaged Integrated Circuits: Correlation of the Packaging Fallout to the Chemistry of Passivation Dielectrics in an Al-Cu System
Published: 3/19/2012
Authors: Chukwudi Azubuike Okoro, Yaw S Obeng
Abstract: In this paper, we use a variety of analytical techniques to examine the impact of local chemistry, and the mechanical properties, of the encapsulation dielectric films on the post-packaging device rejection rate of integrated circuit devices. A stro
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=909379
2.
Towards clean and crackless transfer of graphene
Published: 1/2/2012
Authors: Xuelei X. Liang, Brent A Sperling, Irene G. Calizo, Guangjun Cheng, Christina Ann Hacker, Qin Zhang, Yaw S Obeng, Kai Yan, Hailin Peng, Qiliang Li, Xiaoxiao Zhu, Hui Yuan, Angela R Hight Walker, Zhongfan Liu, Lianmao Peng, Curt A Richter
Abstract: We present the results of a thorough study of wet chemical methods for transferring chemical vapor deposition grown graphene from the metal growth substrate to a device compatible substrate. Based on these results, we have developed a “modified RCA c
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908399
3.
Graphene, Ge/III-V, Nanowires and Emerging Materials for Post-CMOS Applications 3 -and- Tutorials in Nanotechnology: Dielectrics in Nanosystems
Published: 4/21/2011
Authors: Alamgir Karim, Veena Misra, G. Srinivasan, Yaw S Obeng, S De Gendt
Abstract: This issue of ECS Transactions will cover the following topics in (a) Graphene Material Properties, Preparation, Synthesis and Growth; (b) Metrology and Characterization of Graphene; (c) Graphene Devices and Integration; (d) Graphene Transport and mo
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908455
4.
Graphene - Is it the future for Semiconductors? A High Level Overview of Materials, Devices and Applications.
Published: 4/11/2011
Authors: Yaw S Obeng, P Srinivasan
Abstract: In this paper, we attempt to summarize the graphene component of the first two of the GRAPHENE, Ge/III-V AND EMERGING MATERIALS FOR POST-CMOS APPLICATIONS symposia [1, 2]. While not exhaustive and complete, a review of the papers presented at these s
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907706
5.
The Case for Innovations in Photovoltaics: the Nonmaterial Edge
Published: 1/26/2011
Authors: Yaw S Obeng, Kathleen Richardson
Abstract: The limitations of current thin film and the gaps to cost efficient photovoltaic (PV) cells will be discussed in the presentation. This discussion will suggest ways to improve PV cell performance through the use of reduced dimension materials (e.g.,
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907680
6.
US Anti-Counterfeiting Standards Development Activities: An Overview
Published: 12/1/2010
Authors: Yaw S Obeng, Eric D Simmon, YaShian Li-Baboud
Abstract: Counterfeit electronics components impact performance, hence can be viewed as a reliability concern.
Several different strategies have been proposed to mitigate the penetration and impact of counterfeits on the supply chain.
Standards afford effe
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907215
7.
Advanced Metrology for Nanoelectronics at the National Institute of Standards and Technology
Published: 3/11/2009
Authors: Joaquin (Jack) Martinez, Yaw S Obeng, Stephen Knight
Abstract: A broad range of programs at the National Institute of Standards and Technology address critical metrology and characterization challenges facing the nanoelectronics industry. A brief history of the program will be included. From these programs we
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=901409
8.
Identity management standards for product life cycle of electronic parts
Published: 9/10/2008
Authors: YaShian Li-Baboud, Eric D Simmon, Yaw S Obeng
Abstract: The high profit opportunities, the diffused outsourcing of manufacturing and the structure of distribution networks make the electronics and its components susceptible to counterfeiting. Distinguishing the genuine article from counterfeit is increasi
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=33159
9.
Strategies for Closing the ITRS Funding Gap
Published: 8/18/2008
Authors: Yaw S Obeng, Stephen Knight, Joaquin (Jack) Martinez
Abstract: For over 35 years, each IC generation has doubled the transistor count while cutting the cost per function in half. This progress, described by Moore's Law, has resulted primarily from scaling device dimensions and wafer size. In reality, the 'Moore
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=33009
10.
Semiconductor Microelectronics and Nanoelectronics Programs
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 7513
Published: 7/1/2008
Authors: Stephen Knight, Joaquin (Jack) Martinez, Yaw S Obeng, Michele L. Buckley
Abstract: The microelectronics industry supplies vital components to the electronics industry and to the U.S. economy, enabling rapid improvements in productivity and in new high technology growth industries such as electronic commerce and biotechnology. The N
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=33067