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You searched on: Author: mark vaudin

Displaying records 11 to 20 of 85 records.
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11. Measurement of heat capacity and enthalpy of formation of Nickel Silicide using Nano-calorimetry
Published: 11/2/2009
Authors: Ravi Kummamuru, Lito De La Rama, Liang Hu, Mark D Vaudin, Mikhail Efremov, Martin L Green, David A LaVan, Leslie Allen
Abstract: We present characterization of energetics of the reaction between nickel and silicon thin films using differential scanning nano-calorimetry (nano-DSC). For the first time, nano-DSC measurements up to 850 °C and of enthalpy of thin film reactions hav ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=902298

12. Stress-Intensity Factor and Toughness Measurement at the Nanoscale using Confocal Raman Microscopy
Published: 7/12/2009
Authors: Robert Francis Cook, Yvonne Beatrice Gerbig, Mark D Vaudin, Jeroen Schoenmaker, Stephan J Stranick
Abstract: A confocal Raman microscopy technique is presented that allows stress measurement at the nanoscale, which in turn enables measurement of stress-intensity factors (SIF) at crack tips and thus toughness to be estimated. Peak-fitting and super-resolutio ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=900910

13. Effect of crystallographic orientation on phase transformations during indentation of silicon
Published: 3/9/2009
Authors: Yvonne Beatrice Gerbig, Dylan Morris, Stephan J Stranick, Mark D Vaudin, Robert Francis Cook
Abstract: In a statistical nanoindentation study using a spherical probe, the effect of crystallographic orientation on the phase transformation of silicon (Si) was investigated. The presence and pressure at which events associated with phase transformation oc ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=854143

14. Experimental and Simulation Studies of Resistivity of Nanoscale Copper Films
Published: 2/19/2009
Authors: Emre Yarimbiyik, Harry A. Schafft, Richard A Allen, Mark D Vaudin, Mona E. Zaghloul
Abstract: The effect of film thickness on the resistivity of thin, evaporated copper films (approximately 10 nm to 150 nm thick) was determined from sheet resistance, film thickness, and mean grain-size measurements by using four-point probe, profilometer, and ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=32595

15. Structural and thermoelectric properties of Bi2Sr2Co2Oy thin films on LaAlO3 (100) and fused silica substrates
Published: 1/12/2009
Authors: Winnie K Wong-Ng, Mark D Vaudin, Shufang Wang, L Venimadhav, Shengming Guo, Ke Chen, Qi Li, A Soukiassian, D.G. Schlom, X.Q. Pan, D.G. Cahill, X. X. Xi
Abstract: We have grown Bi2Sr2Co2Oy thin films on LaAlO3 (100) and fused silica substrates by pulsed laser deposition. The films on LaAlO3 are c-axis oriented and partially in-plane aligned with multiple domains while the films on fused silica are preferred c- ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=900129

16. Measurement of Axisymmetric Crystallographic Texture
Series: Special Publication (NIST SP)
Report Number: sp
Published: 1/1/2009
Author: Mark D Vaudin
Abstract: Crystallographic texture has for many years been the fiefdom of metallurgists and geologists, who have developed elegant methodologies for the analysis of highly complex textures and texture evolutions. Over the past two decades, the importance and ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851083

17. Comparison of Nanoscale Measurements of Strain and Stress using Electron Back Scattered Diffraction and Confocal Raman Microscopy
Published: 12/12/2008
Authors: Mark D Vaudin, Yvonne Beatrice Gerbig, Stephan J Stranick, Robert Francis Cook
Abstract: Strains in Si as small as 104 (corresponding to stresses of 10 MPa) have been measured using electron back scatter diffraction (EBSD), with spatial resolution close to 10 nm, and confocal Raman microscopy (CRM) with spatial resolution app ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=854129

18. Surface Effects on the Elastic Modulus of Te Nanowires
Published: 6/17/2008
Authors: Gheorghe Stan, Sergiy Krylyuk, Albert Davydov, Mark D Vaudin, Leonid A Bendersky, Robert Francis Cook
Abstract: Nondestructive elastic property measurements have been performed on Te nanowires with diameters in the range 20 150 nm. By using contact resonance atomic force microscopy, the elastic indentation modulus perpendicular to the prismatic facets of the n ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851078

19. Equi-Axed Grain Formation in Electrodeposited Sn-Bi
Published: 4/1/2008
Authors: E Sandnes, Maureen E Williams, Mark D Vaudin, Gery R Stafford
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=854416

20. Equi-Axed Grain Formation in Electrodeposited Sn-Bi
Published: 12/29/2007
Authors: E Sandnes, Maureen E Williams, Mark D Vaudin, Gery R Stafford
Abstract: Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity and corrosion resistance. However, Sn whiskers have been observed to grow spontaneously from Sn electrodeposit ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853522



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