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Author: thomas siewert

Displaying records 41 to 50 of 74 records.
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41. LEAD-FREE SOLDER DATA: COLLECTION AND DEVELOPMENT
Published: 1/10/2005
Authors: Thomas Allen Siewert, David R. Smith, Yi-Wen Cheng, Juan C Madeni, S X Liu
Abstract: The rising interest in lead-free solders creates a need for complete property data on the various lead-free solder compositions. Various types of data are available, but are widely dispersed through the literature. To improve the sharing of this impo ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=30058

42. FORENSIC STUDY OF THE STEEL IN THE WORLD TRADE CENTER
Published: 12/30/2004
Authors: Thomas Allen Siewert, Joseph David McColskey, Christopher N McCowan, Frank W Gayle, William E Luecke, Stephen W Banovic, Timothy J Foecke, Richard Joel Fields
Abstract: In September of 2002, the National Institute of Standards and Technology began a two-year investigation into the World Trade Center (WTC) disaster of September 11, 2001. Now almost complete, the investigation addresses many aspects of the catastrophe ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=30059

43. The Structural Steel of the World Trade Center Towers
Published: 10/1/2004
Authors: Frank W Gayle, Stephen W Banovic, Timothy J Foecke, Richard Joel Fields, William E Luecke, Joseph David McColskey, Thomas Allen Siewert, Christopher N McCowan
Abstract: In September 2002, the National Institute of Standards and Technology became the lead agency in an investigation of the World Trade Center (WTC) disaster of September 11, 2001. The investigation addresses many aspects of the catastrophe, from occupa ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853353

44. NEMI Lead-Free Assembly Project: Comparison Between PbSn and SnAgCu Reliability and Microstructures
Published: 11/1/2003
Authors: C A. Handwerker, J Bath, E - Benedetto, E - Bradley, R - Gedney, Thomas Allen Siewert, P Snugovsky, J - Sohn
Abstract: The National Electronics Manufacturing Initiative (NEMI) Lead-Free Assembly Project had the following priorities:--to down-select an alloy from the SnAgCu families to be recommended as the main standard lead-free solder;--to demonstrate production-re ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853288

45. Thirteenth International Conference on Computer Technology in Welding
Series: Special Publication (NIST SP)
Published: 10/1/2003
Authors: Thomas Allen Siewert, William G Rippey
Abstract: The Thirteenth International Conference on Computer Technology in Welding was held June 18, 2003 in Orlando, Florida, under the sponsorship of the American Welding Society, the National Institute of Standards and Technology (NIST), and The Welding In ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851339

46. The NIST Charpy V-Notch Verification Program: Overview and Operating Procedures
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 1500-9
Published: 9/1/2003
Authors: Christopher N McCowan, Thomas Allen Siewert, D P Vigliotti
Abstract: Charpy impact testing is often specified as ,in acceptance test for structural materials, and companies performing acceptance tests are typically required to verify the performance of their impact machine periodically. The procedure for verifying th ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851238

47. Formation and Growth of Intermetallics at the Interface Between Lead-Free Solders and Copper Substrates
Published: 6/16/2003
Authors: Thomas Allen Siewert, Juan C Madeni, S X Liu
Abstract: Intermetalhc formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu, Sn-3.5Ag, Sn-0.7Cu, and Sn-9Zn.,Coupons of solder joints (prepared by melting some of each solder alloy on a copper-plated circuit board) weresubjected to e@-ag'm-g tests f ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851326

48. Intermetallics Formation and Growth at the Interface of Tin-Based Solder Alloys and Copper Substrates
Published: 2/17/2003
Authors: Juan C Madeni, S X Liu, Thomas Allen Siewert
Abstract: Increasing concerns regarding environmental contamination is driving the soldering research community to develop lead-free solder alloys. Previous studies have shown that Sn-based alloys such as Sn-3.5Ag, Sn-0.7Cu, Sn-9Zn, and Sn-3.2Ag-O. ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851327

49. Application of an On-Line Weld Monitoring System
Published: 9/12/2002
Authors: Thomas Allen Siewert, Ivan Samardzic, Stefanija Klaric
Abstract: quisition analysis and real-time manipulation of the welding parameters offer added controls over the weld quality. Thanks to the continual development of information technology and electronics, it is possible to improve the systems for monitoring ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851294

50. Test Procedures for Developing Solder Data
Series: Special Publication (NIST SP)
Report Number: 960-8
Published: 8/1/2002
Authors: Thomas Allen Siewert, C A. Handwerker
Abstract: This publication documents standardized test procedures that can produce valid and reproducible mechanical property data for lead-free solders. Such data speeds the application of lead-free solders in high-volume, automated production of electronic a ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851260



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