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You searched on: Author: zachary levine

Displaying records 91 to 100 of 112 records.
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91. Intrinsic birefringence in cubic crystals: a new concern for lithography
Published: 1/1/2001
Authors: J H Burnett, Zachary H Levine, Eric L Shirley
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=101380

92. Calibration of High-Resolution X-Ray Tomography With Atomic Force Microscopy
Series: Journal of Research (NIST JRES)
Published: 11/1/2000
Authors: A R Kalukin, B Winn, S S Wang, C Jacobsen, Zachary H Levine, Joseph Fu
Abstract: For two-dimensional x-ray imaging of thin films, the technique of scanning transmission x-ray miscroscopy (STXM) has achieved images with feature sizes as small as 40 nm in recent years. However, calibration of three-dimensional tomographic images t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=840060

93. Tomography of Integrated Circuit Interconnect With an Electromigration Void
Published: 5/1/2000
Authors: Zachary H Levine, A R Kalukin, M Kuhn, S P Frigo, I McNulty, C C Retsch, Y Wang, Uwe Arp, Thomas B Lucatorto, Bruce D Ravel, Charles S Tarrio
Abstract: An integrated circuit interconnect was subject to accelerated-life conditions to induce an electromigration void. The silicon substrate was removed, leaving only the interconnect encased test structure encased in silica. We imaged the sample wit ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=840087

94. Calibration of High-Resolution X-Ray Tomography with Atomic Force Microscopy,
Series: Journal of Research (NIST JRES)
Published: 1/1/2000
Authors: A R Kalukin, B Winn, S S Wang, C Jacobsen, Zachary H Levine, Jing Fu
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=101582

95. Microtomography of an integrated circuit interconnect with an electromigration void
Published: 1/1/2000
Authors: Zachary H Levine, A R Kalukin, M Kuhn, S P Frigo, I McNulty, C C Retsch, Ying-ju Wang, Uwe Arp, Thomas B Lucatorto, B D Ravel, Charles S Tarrio
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=101604

96. Methods to Remove Distortion Artifacts in Scanned Projections
Published: 7/1/1999
Authors: A R Kalukin, Zachary H Levine, Charles S Tarrio, S P Frigo, I McNulty, S S Wang, C C Retsch, M Kuhn, B Winn
Abstract: Atrifacts induced by distortions which sometimes occur in two-dimensional projection images can appear in the resulting tomographic reconstructions. We describe a procedure for analyzing, correcting and removing experimental atrifacts, and hence redu ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=840077

97. Identification of Materials in Integrated Circuit Interconnects Using X-Ray Absorption Near Edge Spectroscopy
Published: 1/1/1999
Authors: Zachary H Levine, Bruce D Ravel
Abstract: Most integrated circuit interconnects are principally composed of a few metals, including aluminum alloyed with copper, tungsten, titanium, A1^d3^ Ti, and A1^d2^Cu, in a silica matrix. Integrated circuit interconnects have recently been proposed as ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=840009

98. Identification of Materials in Integrated Circuit Interconnects Using X-Ray Absorption Near-Edge Spectroscopy
Published: 1/1/1999
Authors: Zachary H Levine, B D Ravel
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=101606

99. Tomographic Reconstruction of an Integrated Circuit Interconnect
Published: 1/1/1999
Authors: Zachary H Levine, A R Kalukin, S P Frigo, I McNulty, M Kuhn
Abstract: An Al-W-silica integrated circuit interconnect sample was thinned to several micro {mu} and scanned across a 200 nm focal spot of a Fresnel zone plate operating at photon energy of 1573 eV. The experiment was performed on beamline 2-ID-B of the Adva ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=840049

100. Tomographic Reconstruction of an Integrated Circuit Interconnect
Published: 1/1/1999
Authors: Zachary H Levine, A R Kalukin, S P Frigo, I McNulty, M Kuhn
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=101605



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