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You searched on: Author: roy geiss

Displaying records 11 to 20 of 51 records.
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11. In-Situ Measurement of Atomic Force Microscope Tip Wear by Contact Resonance Force Microscopy
Published: 3/15/2011
Authors: Jason Philip Killgore, Roy H. Geiss, Donna C. Hurley
Abstract: Contact resonance force microscopy (CR-FM) mapping provides a means of continuously tracking contact stiffness while scanning an AFM tip in contact with a substrate. Because the contact stiffness is a function of contact radius, tip wear leading to ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907208

12. Argon ion beam alters grain structure of copper in surface preparation for EBSD
Published: 8/1/2010
Authors: Roy H. Geiss, David Thomas Read
Abstract: In preparing specimens of thin films of copper for examination by electron backscatter diffraction (EBSD), surface preparation is often necessary to produce acceptable EBSD patterns. Typically, removal of a rough, damaged or oxidized layer of the sur ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=905077

13. Methods for TEM analysis of NIST‰s SWCNT SRM
Published: 3/25/2010
Authors: Roy H. Geiss, Elisabeth Mansfield, Jeffrey A Fagan
Abstract: The National Institute of Standards and Technology (NIST) is developing a series of single-walled carbon nanotube, SWCNT, reference materials, RMs, to provide researchers with well characterized materials for their applications. The SWCNT reference m ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=905078

14. Resistivity Dominated by Surface Scattering in Sub-50 nm Cu Wires
Published: 1/25/2010
Authors: Rebekah L. Graham, Glenn Alers, Thomas Mountsier, N. Shamma, S. Dhuey, R. H. Cabrini, Roy H. Geiss, David Thomas Read, S. Peddeti
Abstract: The electron scattering mechanisms in sub-50nm copper lines were investigated to understand the extendibility of copper interconnects when the line width or thickness is less than the mean free path. Electron-beam lithography and a dual hardmask a ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=903749

15. Elastic constants and dimensions of imprinted polymeric nanolines determined from Brillouin light scattering
Published: 1/18/2010
Authors: Ward L Johnson, Sudook A. Kim, Roy H. Geiss, Colm Flannery, Paul R Heyliger, Christopher L Soles, Wen-Li Wu, Chengqing C. Wang, Christopher M Stafford, B D. Vogt
Abstract: Elastic constants and cross-sectional dimensions of imprinted nanolines of poly(methyl methacrylate) (PMMA) on silicon are determined nondestructively from finite-element inversion analysis of dispersion curves of hypersonic acoustic modes of these ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=903959

16. Transmission Electron Diffraction from nanoparticles, nanowires and thin films in an SEM using conventional EBSD equipment
Published: 1/1/2010
Authors: Roy H. Geiss, Robert R Keller, David Thomas Read
Abstract: We describe a new scanning electron microscope (SEM) method for obtaining and analyzing the crystallographic structure and orientation in nanoparticles and ultrathin films using conventional electron backscatter diffraction (EBSD) equipment.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=905080

17. Effect of microstructure on magnetic properties and anisotropy distributions in Co/Pd thin films and nanostructures
Published: 11/19/2009
Authors: Justin M Shaw, Hans Toya Nembach, Thomas J Silva, Stephen E Russek, Roy H. Geiss
Abstract: The structure of Co/Pd multilayers has a strong effect on the localized anisotropy distribution within a film and the resulting switching properties of nanostructures fabricated from identical material. By varying the underlying seed layer, the micr ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=903594

18. Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films
Published: 10/13/2009
Authors: Ryan Paul Birringer, Roey Shaviv, Thomas Mountsier, Jon Reid, Jian Zhou, Roy H. Geiss, David Thomas Read, Reinhold Dauskardt
Abstract: Effects of the chemistry of electroplated copper films on stress-induced voiding and adhesion between the films and a SiN barrier layer are reported. The void density as observed by scanning electron microscopy decreased markedly with increasing Cu p ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=903753

19. Methods for TEM analysis of NIST s single-walled carbon nanotube Standard Reference Material
Published: 8/20/2009
Authors: Elisabeth Mansfield, Roy H. Geiss, Jeffrey A Fagan
Abstract: The National Institute of Standards and Technology (NIST) is releasing a series of single-walled carbon nanotube Standard Reference Materials (SRMs) to provide consumers with a well-characterized material for their applications. The SWCNT Reference ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=903069

20. EBSD Analysis of Narrow Damascene Copper Lines
Published: 5/11/2009
Authors: Roy H. Geiss, David Thomas Read, Glenn Alers, Rebekah L. Graham
Abstract: Orientation imaging microscopy (OIM) by electron back scatter diffraction (EBSD) has been used to examine grain size and crystallographic orientations of damascene Cu lines nominally 25 nm to 55 nm in width and 100 nm thick. These are the smallest st ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=902513



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