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You searched on: Author: roy geiss

Displaying records 11 to 20 of 44 records.
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11. Transmission Electron Diffraction from nanoparticles, nanowires and thin films in an SEM using conventional EBSD equipment
Published: 1/1/2010
Authors: Roy H. Geiss, Robert R Keller, David Thomas Read
Abstract: We describe a new scanning electron microscope (SEM) method for obtaining and analyzing the crystallographic structure and orientation in nanoparticles and ultrathin films using conventional electron backscatter diffraction (EBSD) equipment.

12. Effect of microstructure on magnetic properties and anisotropy distributions in Co/Pd thin films and nanostructures
Published: 11/19/2009
Authors: Justin M Shaw, Hans Toya Nembach, Thomas J Silva, Stephen E Russek, Roy H. Geiss
Abstract: The structure of Co/Pd multilayers has a strong effect on the localized anisotropy distribution within a film and the resulting switching properties of nanostructures fabricated from identical material. By varying the underlying seed layer, the micr ...

13. Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films
Published: 10/13/2009
Authors: Ryan Paul Birringer, Roey Shaviv, Thomas Mountsier, Jon Reid, Jian Zhou, Roy H. Geiss, David Thomas Read, Reinhold Dauskardt
Abstract: Effects of the chemistry of electroplated copper films on stress-induced voiding and adhesion between the films and a SiN barrier layer are reported. The void density as observed by scanning electron microscopy decreased markedly with increasing Cu p ...

14. Methods for TEM analysis of NIST s single-walled carbon nanotube Standard Reference Material
Published: 8/20/2009
Authors: Elisabeth Mansfield, Roy H. Geiss, Jeffrey A Fagan
Abstract: The National Institute of Standards and Technology (NIST) is releasing a series of single-walled carbon nanotube Standard Reference Materials (SRMs) to provide consumers with a well-characterized material for their applications. The SWCNT Reference ...

15. EBSD Analysis of Narrow Damascene Copper Lines
Published: 5/11/2009
Authors: Roy H. Geiss, David Thomas Read, Glenn Alers, Rebekah L. Graham
Abstract: Orientation imaging microscopy (OIM) by electron back scatter diffraction (EBSD) has been used to examine grain size and crystallographic orientations of damascene Cu lines nominally 25 nm to 55 nm in width and 100 nm thick. These are the smallest st ...

16. Electron Microscope Study of Strain in InGaN Quantum Wells in GaN Nanowires
Published: 4/1/2009
Authors: Roy H. Geiss, David Thomas Read
Abstract: GaN nanowires with InGaN quantum wells (QW) were grown on heated Si(111) substrates by molecular beam epitaxy (MBE) using elemental Ga and In and a radio-frequency-plasma N2 source. The growth procedures and the morphology of these nanowires have bee ...

17. Micrometer-width damascene copper conductors at e10 MA/cm2
Published: 1/1/2009
Authors: David Thomas Read, Roy H. Geiss
Abstract: We have applied high amplitude (~10 MA/cm2) alternating current (AC) at 100 Hz and direct current (DC) to copper interconnect lines with widths in the few-micrometer range covered with a thick layer of SiO2. Under our test conditions of Joule heating ...

18. Thermal Cycling of Buried Damascene Copper Interconnect Lines by Joule Heating
Published: 1/1/2008
Authors: David Thomas Read, Roy H. Geiss
Abstract: We report tests to failure of 300 nm wide damascene copper interconnect lines in silicon oxide dielectric, under high amplitude, low frequency alternating current. The cyclic minimum and maximum resistances were obtained from the measured voltage and ...

19. Constraint Effect in Deformation of Copper Interconnect Lines Subjected to Cyclic Joule Heating
Published: 11/26/2007
Authors: David Thomas Read, Roy H. Geiss, Nicholas Barbosa
Abstract: Using finite element analysis, we calculate the temperature range and the resulting cyclic Von Mises strain resulting from Joule heating, generated by the application of alternating current, applied to specimens representative of commercial copper da ...

20. An Electrical Method for Measuring Fatigue and Tensile Properties of Thin Films on Substrates
Published: 8/15/2007
Authors: Robert R Keller, Nicholas Barbosa, Roy H. Geiss, David Thomas Read
Abstract: A novel approach for measuring thermal fatigue lifetime and ultimate strength of patterned thin films on substrates is presented. The method is based on controlled application of cyclic joule heating by means of low-frequency, high-density alternatin ...

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