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Author: roy geiss

Displaying records 11 to 20 of 38 records.
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11. Micrometer-width damascene copper conductors at e10 MA/cm2
Published: 1/1/2009
Authors: David Thomas Read, Roy Howard Geiss
Abstract: We have applied high amplitude (~10 MA/cm2) alternating current (AC) at 100 Hz and direct current (DC) to copper interconnect lines with widths in the few-micrometer range covered with a thick layer of SiO2. Under our test conditions of Joule heating ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=903009

12. Thermal Cycling of Buried Damascene Copper Interconnect Lines by Joule Heating
Published: 1/1/2008
Authors: David Thomas Read, Roy Howard Geiss
Abstract: We report tests to failure of 300 nm wide damascene copper interconnect lines in silicon oxide dielectric, under high amplitude, low frequency alternating current. The cyclic minimum and maximum resistances were obtained from the measured voltage and ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853561

13. Constraint Effect in Deformation of Copper Interconnect Lines Subjected to Cyclic Joule Heating
Published: 11/26/2007
Authors: David Thomas Read, Roy Howard Geiss, Nicholas Barbosa
Abstract: Using finite element analysis, we calculate the temperature range and the resulting cyclic Von Mises strain resulting from Joule heating, generated by the application of alternating current, applied to specimens representative of commercial copper da ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=901599

14. An Electrical Method for Measuring Fatigue and Tensile Properties of Thin Films on Substrates
Published: 8/15/2007
Authors: Robert R Keller, Nicholas Barbosa, Roy Howard Geiss, David Thomas Read
Abstract: A novel approach for measuring thermal fatigue lifetime and ultimate strength of patterned thin films on substrates is presented. The method is based on controlled application of cyclic joule heating by means of low-frequency, high-density alternatin ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50479

15. Microstructure of 100 nm damascene copper overburden and lines studied by electron backscatter diffraction
Published: 8/6/2007
Authors: Roy Howard Geiss, David Thomas Read
Abstract: A detailed understanding of the crystallography of metallic conductors in modern interconnect systems is essential if we are to understand the influence of processing parameters on performance and reliability. In particular we must be able to evaluat ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50619

16. RAPID INSPECTION OF CARBON NANOTUBE QUALITY
Published: 7/1/2007
Authors: Stephanie A Hooker, Roy Howard Geiss, Aparna Kar
Abstract: Carbon nanotubes have unique properties of interest for applications in aerospace, electronics, and biotechnology. However, the properties of different batches of carbon nanotubes can vary considerably depending on chemical purity and the nanotube ty ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50489

17. High Amplitude AC Tests of 300-nm Damascene Interconnect Structures
Published: 4/1/2007
Authors: David Thomas Read, Roy Howard Geiss, Glenn Alers
Abstract: The AC fatigue test technique, which uses cyclic joule heating to apply thermal cycles to thin-film structures, was applied to copper lines and vias in damascene dielectric structures on silicon substrates. Specimen chips with two different types of ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50519

18. Need for Standardization of EBSD Measurements for Microstructural Characterization of Thin Film Structures
Published: 3/5/2007
Authors: Roy Howard Geiss, David Thomas Read
Abstract: Microstructural characterization of metal thin films includes measurement of grain size, crystallographic texture and misorientation angle across grain boundaries. All of these measurements can be made simultaneously by the use of electron backscatte ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50521

19. Results of a Nanoindentation Round Robin on Thin Film Copper on Silicon
Published: 1/1/2007
Authors: David Thomas Read, Robert R Keller, Nicholas Barbosa, Roy Howard Geiss
Abstract: Nanoindentation is used in a variety of fields to measure material hardness and elastic modulus. This test technique is especially attractive for thin films because of the difficulty of conducting tensile or other conventional mechanical characteriza ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50334

20. Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects
Published: 1/1/2007
Authors: Robert R Keller, Roy Howard Geiss, Nicholas Barbosa, Andrew J Slifka, David Thomas Read
Abstract: We demonstrate by use of automated electron backscatter diffraction (EBSD) the rapid growth of grains in non-passivated, sputtered Al-1Si interconnects during 200 Hz thermal cycling induced by alternating electric current. Mean grain diameters were o ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50338



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