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You searched on: Author: elizabeth drexler

Displaying records 21 to 30.
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21. An Experimental Method for Measuring Mechanical Properties of Rat Pulmonary Arteries Verified With Latex
Series: Journal of Research (NIST JRES)
Published: 6/1/2003
Authors: Elizabeth S Drexler, Andrew J Slifka, J Wright, Christopher N McCowan, Dudley Finch, Timothy P Quinn, J D McCloskey, Dunbar Ivy, Robin Shandas
Abstract: A study of the biomechanics and hemodynamics of pulmonary hypertension is incomplete without including mechanical properties data comparing healthy and diseased arterial tissue. In the initial stabe of this study, Sprague-Dawley rats will be induced ...

22. Strain Measurements in Thermally-Loaded Circuit Boards Containing Embedded Resistors
Published: 5/1/2002
Authors: Elizabeth S Drexler, R C Snogren, M C Snogren, J J Felten, P A Green
Abstract: Four specimens of embedded resistors were tested from room temperature to the processingtemperature (177 C) to compare deformations in the printed wiring board (PWB) using electron-beam moire. The specimens had different termination sizes and geomet ...

23. Thermomechanical Effects in Embedded Passive Materials
Published: 4/1/2002
Authors: Andrew J Slifka, Elizabeth S Drexler
Abstract: Thermomechanical fatigue was measured using electron-beam moire (EBM) and infrared (IR) microscopy. A specimen was made using FR-4 printed wiring board, (PWB), a silver-filled conductive adhesive, and a carbon-filled conductive paste. Both filled p ...

24. Characterization of Interfaces Involving Electrically Conductive Adhesives Using Electron-Beam Moire and Infrared Microscopy
Published: 3/1/2002
Authors: Andrew J Slifka, Elizabeth S Drexler
Abstract: The complimentary techniques of electron-beam moire and infrared microscopy were used to determine the mechanical and thermal degradation of interfaces involving electrically conductive adhesives. The infrared microscopy technique was used to examin ...

25. Validation of Scanning Probe Moire Technique With the CTE of Gold
Published: 6/1/2001
Authors: Elizabeth S Drexler, T A Winningham
Abstract: Low expansion materials used in electronic devices require a tool that has a commensurate resolution for measuring deformation, such as the atomic force or scanning probe microscope (SPM). The SPM was evaluated for this purpose by conducting experim ...

26. Plastic Strain in Thermally Cycled Flip-Clip PBGA Solder Bumps
Published: 11/1/2000
Author: Elizabeth S Drexler
Abstract: Electron-beam Moire, a technique to measure dis-placements on the sub-micrometer scale, was used to observe and calculate strain in an underfilled, flip-chip plastic ball grid array (PBGA) package. A cross section of the package, instrumented with 4 ...

27. Thermally Induced Deformations in a Flip-Chip HDI Substrate
Published: 5/1/2000
Author: Elizabeth S Drexler
Abstract: At issue was the thermomechanical response of microvias in a high-density interconnect (HDI) substrate. The HDI package containing microvias, blind vias, solder bumps, and line traces was thermally cycled five times between -55 and 125 C in a scann ...

28. Mechanical Deformation in Conductive Adhesives as Measured with Electron-Beam Moire
Published: 6/1/1999
Authors: Elizabeth S Drexler, J R Berger
Abstract: Two forms (paste and film) of isotropically conductive adhesives (Cas) were mechanically loaded in shear mode.

29. Reliability of a Flip-Chip Package Thermally Loaded Between -55 and 125 C
Published: 5/1/1999
Author: Elizabeth S Drexler
Abstract: The low-temperature reliability of flip-chip-on-board (FCOB) packages has been a source of concern for manufacturers of the innovative package.

30. Strain Measurements in A Thermally-Cycled Flip-Chip PBGA Solderball
Published: 3/1/1999
Author: Elizabeth S Drexler
Abstract: The mismatch between the coefficients of thermal expansion of the silicon chip and the organic substrate has been mitigated through the practice of using underfill in flip-chip packages. Yet solder fatigue and package failures still occur. This is ...

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