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Author: elizabeth drexler

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21. Strain Measurements in Thermally-Loaded Circuit Boards Containing Embedded Resistors
Published: 5/1/2002
Authors: Elizabeth S Drexler, R C Snogren, M C Snogren, J J Felten, P A Green
Abstract: Four specimens of embedded resistors were tested from room temperature to the processingtemperature (177 C) to compare deformations in the printed wiring board (PWB) using electron-beam moire. The specimens had different termination sizes and geomet ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851253

22. Thermomechanical Effects in Embedded Passive Materials
Published: 4/1/2002
Authors: Andrew J Slifka, Elizabeth S Drexler
Abstract: Thermomechanical fatigue was measured using electron-beam moire (EBM) and infrared (IR) microscopy. A specimen was made using FR-4 printed wiring board, (PWB), a silver-filled conductive adhesive, and a carbon-filled conductive paste. Both filled p ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851232

23. Characterization of Interfaces Involving Electrically Conductive Adhesives Using Electron-Beam Moire and Infrared Microscopy
Published: 3/1/2002
Authors: Andrew J Slifka, Elizabeth S Drexler
Abstract: The complimentary techniques of electron-beam moire and infrared microscopy were used to determine the mechanical and thermal degradation of interfaces involving electrically conductive adhesives. The infrared microscopy technique was used to examin ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851290

24. Validation of Scanning Probe Moire Technique With the CTE of Gold
Published: 6/1/2001
Authors: Elizabeth S Drexler, T A Winningham
Abstract: Low expansion materials used in electronic devices require a tool that has a commensurate resolution for measuring deformation, such as the atomic force or scanning probe microscope (SPM). The SPM was evaluated for this purpose by conducting experim ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851182

25. Plastic Strain in Thermally Cycled Flip-Clip PBGA Solder Bumps
Published: 11/1/2000
Author: Elizabeth S Drexler
Abstract: Electron-beam Moire, a technique to measure dis-placements on the sub-micrometer scale, was used to observe and calculate strain in an underfilled, flip-chip plastic ball grid array (PBGA) package. A cross section of the package, instrumented with 4 ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851291

26. Thermally Induced Deformations in a Flip-Chip HDI Substrate
Published: 5/1/2000
Author: Elizabeth S Drexler
Abstract: At issue was the thermomechanical response of microvias in a high-density interconnect (HDI) substrate. The HDI package containing microvias, blind vias, solder bumps, and line traces was thermally cycled five times between -55 and 125 C in a scann ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851255

27. Mechanical Deformation in Conductive Adhesives as Measured with Electron-Beam Moire
Published: 6/1/1999
Authors: Elizabeth S Drexler, J R Berger
Abstract: Two forms (paste and film) of isotropically conductive adhesives (Cas) were mechanically loaded in shear mode.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851145

28. Reliability of a Flip-Chip Package Thermally Loaded Between -55 and 125 C
Published: 5/1/1999
Author: Elizabeth S Drexler
Abstract: The low-temperature reliability of flip-chip-on-board (FCOB) packages has been a source of concern for manufacturers of the innovative package.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851158

29. Strain Measurements in A Thermally-Cycled Flip-Chip PBGA Solderball
Published: 3/1/1999
Author: Elizabeth S Drexler
Abstract: The mismatch between the coefficients of thermal expansion of the silicon chip and the organic substrate has been mitigated through the practice of using underfill in flip-chip packages. Yet solder fatigue and package failures still occur. This is ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851363



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