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Author: john bonevich

Displaying records 51 to 60 of 68 records.
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51. Thermal Stability of Ta-Pinned Spin Valves
Published: 6/1/2001
Authors: R A. Fry, Robert D McMichael, John E Bonevich, Andrew Peijie Chen, William F. Egelhoff Jr.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=901881

52. Large Anisotropy Via Oblique Sputtering of Ta Underlayers
Published: 5/1/2001
Authors: John E Bonevich, Robert D McMichael, Chang H Lee, P J Chen, W Wyatt Miller, William F. Egelhoff Jr.
Abstract: Anisotropy fields in excess of 120 KA/m (1500 Oe) have been produced in 3 nm to 5 nm thick polycrystalline films of Co by oblique sputtering of Ta underlayers. The unusually high anisotropy is magnetostatic in origin, and is induced by corrugations ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852989

53. Cu Electrodeposition for On-Chip Interconnections
Published: 1/1/2001
Authors: Gery R Stafford, Thomas P Moffat, V D Jovic, David R Kelley, John E Bonevich, Daniel Josell, Mark D Vaudin, N G Armstrong, W H Huber, A Stanishevsky
Abstract: The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the elec ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853000

54. Magnetic Anisotropy and Thermal Stability of Ta-pinned Spin Valves
Published: 1/1/2001
Authors: R A. Fry, Robert D McMichael, John E Bonevich, P J Chen, William F. Egelhoff Jr., Chang H Lee
Abstract: It has recently been found that large uniaxial anisotropy fields in excess of 120 kA/m (1500 Oe) can be created in thin (3 nm to 5 nm) films of Co by obliquely sputtered Ta underlayers. This anisotropy can be used to pin the bottom film of a spin va ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853035

55. Strong Anisotropy in Thin Magnetic Films Deposited on Obliquely Sputtered Ta Underlayers
Published: 11/1/2000
Authors: Robert D McMichael, C G Lee, John E Bonevich, P J Chen, W Wyatt Miller, William F. Egelhoff Jr.
Abstract: Anisotropy fields in excess of 120 kA/m (1500 Oe) have been produced in 3-5 nm- thick polycrystalline films of Co by oblique sputtering of Ta underlayers. The unusually high anisotropy is magnetostatic in origin, and is induced by corrugations on th ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852975

56. Comparison of Electrical CD Measurements and Cross-Section Lattice-Plane Counts of Sub-Micrometer Features Replicated in (100) Silicon-on-Insulator Material
Published: 6/1/2000
Authors: Michael W Cresswell, John E Bonevich, T J. Headley, Richard A Allen, Lucille A. Giannuzzi, Sarah C. Everist, Rathindra Ghoshtagore, Patrick J. Shea
Abstract: Test structures of the type known as cross-bridge resistors have been patterned in (100) epitaxial silicon material that was seeded on Bonded and Etched-Back silicon-on-Insulator (BESOI) substrates. The electrical CDs (Critical Dimensions) of a limit ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=5697

57. Correlation of the optical gap of (Ba,Sr)yTiO^d2+y^ thin films with film composition
Published: 6/1/2000
Authors: L D. Rotter, Mark D Vaudin, John E Bonevich, Debra L Kaiser, S 0. Park
Abstract: A series of (Ba^d1-x^,Sr^dx^)yTiO^d2+y^ films with a wide range of y and x < 0.07 was grown by metalorganic chemical vapor deposition. The composition of the films was determined by wavelength dispersive x-ray spectrometry. Transmission spectra ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=850224

58. Thermal Transport Through Thin Films: Mirage Technique Measurements on Aluminum/Titanium Multilayers
Published: 3/1/2000
Authors: E J Gonzalez, John E Bonevich, Gery R Stafford, Grady S White, Daniel Josell
Abstract: Thermal transport properties of multilayer thin films both normal and parallel to the layers were measured. Al/Ti multilayer films 3 m thick, with individual layers systematically varied from 2.5 to 40 nm, were studied on Si substrates. Layers of ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=850345

59. Measuring the Interface Stress: Silver/Nickel Interfaces
Published: 11/1/1999
Authors: Daniel Josell, John E Bonevich, I Shao, R C Cammarata
Abstract: Interface stress is a surface thermodynamics quantity associated with the reversible work of elastically straining an internal solid interface. In a multilayered thin film, the combined effect of the interface stress of each interface results in an i ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852925

60. Face-Centered Cubic Titanium: An Artifact in Titanium/Aluminum Multilayers
Published: 5/1/1999
Authors: John E Bonevich, D van Heerden, Daniel Josell
Abstract: The present investigation is the first comprehensive comparative study of x-ray diffraction (XRD) and transmission electron microscopy (TEM) results to address the important issue of fcc Ti formation in nanoscale multilayers Ti/Al multilayers with 7. ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852886



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