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You searched on: Author: john bonevich

Displaying records 51 to 60 of 72 records.
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51. Superconformal Electrodeposition of Silver in Submicrometer Features
Published: 8/1/2002
Authors: Thomas P Moffat, B C Baker, Daniel Wheeler, John E Bonevich, Monica D Edelstein, D R Kelly, L Gan, Gery R Stafford, P J Chen, William F. Egelhoff Jr., Daniel Josell
Abstract: The generality of the curvature enhanced accelerator coverage (CEAC) model of superconformal electrodeposition is demonstrated through application to superconformal filling of fine trenches during silver deposition from selenium-catalyzed silver cyan ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853123

52. Ferromagnetic resonance mode interactions in periodically perturbed films
Published: 5/15/2002
Authors: Robert D McMichael, D J Twisselmann, John E Bonevich, A P Chen, W F Egelhoff, Stephen E Russek
Abstract: Ferromagnetic resonance mode interactions in periodically perturbed films
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=30817

53. Ferromagnetic Resonance Mode Interactions in Periodically Perturbed Films
Published: 5/1/2002
Authors: Robert D McMichael, D J Twisselmann, John E Bonevich, P J Chen, William F. Egelhoff Jr., Stephen E Russek
Abstract: rromagnetic resonance linewidth measurements are reported for thin films of Ni^d80^Fe^d20^ deposited on substrates with 320 nm period grooves or parallel aperiodic scratches. These films are model systems for studying the effects of inhomogeneity o ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853086

54. A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches
Published: 11/2/2001
Authors: Daniel Josell, Daniel Wheeler, W H Huber, John E Bonevich, Thomas P Moffat
Abstract: We present a single variable first-order differential equation for predicting the occurrence of superconformal electrodeposition. The equation presumes that the dependence of deposition rate on surface coverage of accelerator is known (e.g., derived ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853067

55. Electrical Linewidth Test Structures Patterned in (100) Silicon-on-Insulator for Use as CD Standards
Published: 11/1/2001
Authors: Michael W. Cresswell, John E Bonevich, Richard A Allen, Nadine Guillaume, Lucille A. Giannuzzi, Sarah C. Everist, Christine E. Murabito, Patrick J. Shea, Loren W. Linholm
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=29996

56. From Bulk to Nanoscale Magnetism and Exchange Bias in CuO Nanoparticles
Published: 11/1/2001
Authors: A Punnoose, H Magnone, M Seehra, John E Bonevich
Abstract: Detailed studies of the temperature (5 K to 350 K) and magnetic field variations (up to H = 50 k0e) of the magnetization of CuO nanoprticles of size range 37 nm to 6.6 nm are reported. These particles are synthesized by the sol-gel method in combina ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853077

57. Thermal Stability of Ta-Pinned Spin Valves
Published: 6/1/2001
Authors: R A. Fry, Robert D McMichael, John E Bonevich, Andrew Peijie Chen, William F. Egelhoff Jr.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=901881

58. Large Anisotropy Via Oblique Sputtering of Ta Underlayers
Published: 5/1/2001
Authors: John E Bonevich, Robert D McMichael, Chang H Lee, P J Chen, W Wyatt Miller, William F. Egelhoff Jr.
Abstract: Anisotropy fields in excess of 120 KA/m (1500 Oe) have been produced in 3 nm to 5 nm thick polycrystalline films of Co by oblique sputtering of Ta underlayers. The unusually high anisotropy is magnetostatic in origin, and is induced by corrugations ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852989

59. Cu Electrodeposition for On-Chip Interconnections
Published: 1/1/2001
Authors: Gery R Stafford, Thomas P Moffat, V D Jovic, David R Kelley, John E Bonevich, Daniel Josell, Mark D Vaudin, N G Armstrong, W H Huber, A Stanishevsky
Abstract: The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the elec ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853000

60. Magnetic Anisotropy and Thermal Stability of Ta-pinned Spin Valves
Published: 1/1/2001
Authors: R A. Fry, Robert D McMichael, John E Bonevich, P J Chen, William F. Egelhoff Jr., Chang H Lee
Abstract: It has recently been found that large uniaxial anisotropy fields in excess of 120 kA/m (1500 Oe) can be created in thin (3 nm to 5 nm) films of Co by obliquely sputtered Ta underlayers. This anisotropy can be used to pin the bottom film of a spin va ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=853035



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