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Author: richard allen

Displaying records 11 to 20 of 122 records.
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11. Nano- and Atom-scale Length Metrology
Published: 10/1/2010
Authors: Theodore Vincent Vorburger, Ronald G Dixson, Ndubuisi George Orji, Joseph Fu, Richard A Allen, Michael W Cresswell, Vincent A Hackley
Abstract: Measurements of length at the nano-scale have increasing importance in manufacturing, especially in the electronics and biomedical industries. The properties of linewidth and step height are critical to the function and specification of semiconducto ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906609

12. MEMS Young's Modulus and Step Height Measurements with Round Robin Results
Published: 9/30/2010
Authors: Janet M Cassard, Richard A Allen, Craig Dyer McGray, Jon C Geist
Abstract: This paper presents the results of a microelectromechanical systems (MEMS) Young s modulus and step height round robin experiment, completed in April 2009, which compares Young s modulus and step height measurement results at a number of laboratories ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=904949

13. MEMS Standards Development at the National Institute of Standards and Technology
Published: 7/22/2010
Author: Richard A Allen
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906337

14. A Round Robin Experiment to Compare Methods to Measure Voids in Bonded Wafer Pairs
Published: 7/14/2010
Author: Richard A Allen
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906335

15. A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES
Published: 12/7/2009
Authors: Richard A Allen, Winthrop A. Baylies, Paul Langer, Ralph Danzl, Frank W DelRio, Gavin Horn, Roy Knechtel, Michael Mattes, David Thomas Read, Sumant Sood, Kevin T. Turner
Abstract: An international round robin was organized to update SEMI Standard MS5: Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures. Results from the round robin allowed for inclusion of a Precision and Bias statement. The ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=904232

16. Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures
Published: 12/7/2009
Author: Richard A Allen
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907001

17. Mobile Microrobot Characterization through Performance-Based Competitions
Published: 11/19/2009
Authors: Jason John Gorman, Craig Dyer McGray, Richard A Allen
Abstract: Recent advances in the design and fabrication of microelectromechanical systems (MEMS) have enabled the development of mobile microrobots that can autonomously navigate and manipulate in controlled environments. It is expected that this technology wi ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=904187

18. Wafer Bond Strength MS5-1107 Revision and Future plans
Published: 11/2/2009
Author: Richard A Allen
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907002

19. MEMS Standards Development at the National Institute of Standard and Technology
Published: 10/12/2009
Author: Richard A Allen
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907000

20. Nanoindentation of Si Nanostructures: Buckling and Friction at Nanoscales
Published: 9/18/2009
Authors: Huai Huang, Bin Li, Qiu Zhao, Zhiquan Luo, Jay Im, Min Kang, Richard A Allen, Michael W Cresswell, Rui Huang, Paul S. Ho
Abstract: A nanoindentation system was employed to characterize mechanical properties of silicon nanolines (SiNLs), which were fabricated by an anisotropic wet etching (AWE) process. The SiNLs had the linewidth ranging from 24 nm to 90 nm, having smooth a ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=902683



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