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You searched on: Author: richard allen

Displaying records 11 to 20 of 126 records.
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11. Rectangular Scale-Similar Etch Pits in Monocrystalline Diamond
Published: 9/15/2011
Authors: Craig Dyer McGray, Richard A Allen, Marc J Cangemi, Jon C Geist
Abstract: Etching of monocrystalline diamond in oxygen and water vapor at 1100° C through small pores in a silicon nitride film produced smooth-walled rectangular cavities. The cavities were imaged by electron microscope and measured by interferometric microsc ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908075

12. Test Structure Fundamentals
Published: 4/4/2011
Author: Richard A Allen
Abstract: Test structures are critical tools for semiconductor manufacturers, allowing for understanding of the process and individual circuit elements that cannot be acquired from measurements of the circuits, which can have billions of transistors and othe ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908448

13. Intercomparison of Methods for Detecting and Characterizing Voids in Bonded Wafer Pairs
Published: 10/14/2010
Author: Richard A Allen
Abstract: The Wafer Bond Task Force of the SEMI MEMS Standards Committee has begun a round robin experiment to evaluate methods for identifying and characterizing voids in bonded wafer pairs for three-dimensional integrated circuit (3D IC) applications. Due ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908447

14. Intercomparison of Methods for Detecting and Characterizing Voids in Bonded Wafer Pairs
Published: 10/1/2010
Authors: Richard A Allen, Andrew C. Rudack, David Thomas Read, Winthrop A. Baylies
Abstract: The Wafer Bond Task Force of the SEMI MEMS Standards Committee has begun a round robin experiment to evaluate methods for identifying and characterizing voids in bonded wafer pairs for three-dimensional integrated circuit (3D IC) applications. Due ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906152

15. Nano- and Atom-scale Length Metrology
Published: 10/1/2010
Authors: Theodore Vincent Vorburger, Ronald G Dixson, Ndubuisi George Orji, Joseph Fu, Richard A Allen, Michael W. Cresswell, Vincent A Hackley
Abstract: Measurements of length at the nano-scale have increasing importance in manufacturing, especially in the electronics and biomedical industries. The properties of linewidth and step height are critical to the function and specification of semiconducto ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906609

16. MEMS Young's Modulus and Step Height Measurements with Round Robin Results
Published: 9/30/2010
Authors: Janet M Cassard, Richard A Allen, Craig Dyer McGray, Jon C Geist
Abstract: This paper presents the results of a microelectromechanical systems (MEMS) Young s modulus and step height round robin experiment, completed in April 2009, which compares Young s modulus and step height measurement results at a number of laboratories ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=904949

17. MEMS Standards Development at the National Institute of Standards and Technology
Published: 7/22/2010
Author: Richard A Allen
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906337

18. A Round Robin Experiment to Compare Methods to Measure Voids in Bonded Wafer Pairs
Published: 7/14/2010
Author: Richard A Allen
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906335

19. A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES
Published: 12/7/2009
Authors: Richard A Allen, Winthrop A. Baylies, Paul Langer, Ralph Danzl, Frank W DelRio, Gavin Horn, Roy Knechtel, Michael Mattes, David Thomas Read, Sumant Sood, Kevin T. Turner
Abstract: An international round robin was organized to update SEMI Standard MS5: Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures. Results from the round robin allowed for inclusion of a Precision and Bias statement. The ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=904232

20. Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures
Published: 12/7/2009
Author: Richard A Allen
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907001



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