Siewert, T.
and Smith, D.
(2005),
Zeroing in on a Lead-Free Solder Database, Welding Journal, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50183
(Accessed October 14, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Zeroing in on a Lead-Free Solder Database
Published
Author(s)
,
Abstract
The rising interest in lead-free solders creates a need for complete property data on the various lead-free solder compositions. Circuit designers need these data to assess the impact of the transition on product life, and production engineers need these data to determine processing parameters. Various types of data are available, but are widely dispersed through the literature. To improve the sharing of this important information, we developed an on-line database for solder properties emphasizing new lead-free solders. One problem with combining data from many sources was that variations in test procedures led to undesirable scatter.Citation
Welding Journal
Pub Type
Journals
Download Paper
Keywords
copper, intemetallics, lead-free solders, silver, solder, tin
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created October 1, 2005, Updated January 27, 2020