Single Wafer Spray Acid System – Coming FY2015
The CNST plans to purchase three single wafer spray acid tools for delivery in FY2015 to support RCA and Piranha clean processes in the NanoFab cleanroom. The tools will provide improved process performance using a combination of acid spray, ultrasonic, and heat under recipe control to eliminate contamination. In addition, automated processing of substrates from small pieces to 200 mm wafers using pre-programmed cleaning recipes will eliminate potential user exposure to chemicals.
For additional information, please contact Jessie Zhang, 301-975-4565.
New High Resolution Atomic Force Microscope Now Available
An Asylum Cypher AFM has been installed in the NanoFab Post Processing Lab located in 215/C02-2. The new high resolution AFM offers improved measurement resolution and improved ability to adapt the AFM hardware and programming to the needs of researchers. The new AFM is not only a surface characterization tool that uses a nanometer scale probe tip to scan the surface of a material to measure surface topology at the nanoscale, it also will be used to measure bulk properties such as conductivity, magnetic, and thermal-mechanical.
For more information, contact Kerry Siebein, 301-975-8458.
New Wafer Scale Atomic Force Microscope Now Available
A Bruker FastScan AFM has been installed in the NanoFab Cleanroom located in 215/B103. The new wafer scale AFM has the capability to perform non-destructive, nanoscale surface topography and related measurements at several sites across a 200 mm-diameter wafer in short time. This new AFM can be used to characterize the surface roughness after thin film coating and surface patterns after lithography and etching processes.
For more information, contact Rich Kasica, 301-975-2693.
Loadlock Chamber Added to Sputter 1
A loadlock chamber has been added to Sputter 1 located in the NanoFab Cleanroom in 215/B104. The new loadlock chamber allows the process chamber to remain under vacuum during sample load reducing the pump down time to 4x10-4 Pa from 45 minutes to 5 minutes. The faster pump down time allows lower starting pressure which result in better film quality.
For more information, contact Gerard Henein, 301-975-5645.