The NIST Center for Nanoscale Science and Technology (CNST) supports the U.S. nanotechnology enterprise from discovery to production by providing industry, academia, NIST, and other government agencies with access to world-class nanoscale measurement and fabrication methods and technology.
The CNST's shared-use NanoFab gives researchers economical access to and training on a commercial state-of-the-art tool set required for cutting-edge nanotechnology development. The simple application process is designed to get projects started in a few weeks.
Looking beyond the current commercial state of the art, the CNST's NanoLab offers opportunities for researchers to collaborate on creating and using the next generation of nanoscale measurement instruments and methods. more...
New Identification Requirements for Entering the Nist Gaithersburg Campus
Beginning July 21, 2014, the identification requirements for entering the NIST site have changed as required by the 2005 “Real ID” Act. Driver’s licenses from eleven U.S. states (Alaska, Arizona, Kentucky, Louisiana, Maine, Massachusetts, Minnesota*, Montana, New York*, Oklahoma, Washington state*) and American Samoa will no longer be accepted as identification for U.S. citizens. Visitors with these licenses will need to present an approved form of alternative identification to gain access to NIST. State-issued Enhanced Driver’s Licenses from Minnesota, New York, and Washington state, which are identifiable by an American flag icon, may be used as valid identification for access to NIST.
New Reflectance Film Measurement Tool Now Available
The CNST has purchased a new Filmetrics F40-UV reflectometer which is now available to users in the NanoFab cleanroom. The system can be used to measure thin film thickness and optical constants through a UV microscope. The F40-UV is equipped with three microscope objectives that enable measurements on patterned surfaces with a spot size as small as 10 µm. The measurement analysis software provides integrated video to display the sample and measurement location. The software allows users to generate custom film stacks using the large material database to analyze collected data and report resulting film properties.
For more information please contact Marc Cangemi, 301-975-5993.
Veeco Dimension 3100 AFM Moved Outside Cleanroom
Sputter Cluster System Onsite, Installation Underway — Available January 2015
The CNST has received delivery of the 4-Wave Sputtering Cluster System (SCS). Installation is underway and the tool is expected to be available to users by January 2015. This tool will provide users physical deposition capability using the ion beam deposition or biased target deposition techniques resulting in the densest available thin films deposited at room temperature. The SCS has cassette-to-cassette and robot wafer handling, a load lock, and 12 ready-to-deposit materials to provide users clean films deposited on substrates ranging from small pieces up to 200 mm diameter wafers.
For more information, contact Gerard Henein, 301-975-5645.
Direct Write E-Beam Lithography System Now Available
A new JEOL 6300-FS direct write electron beam lithography system has been installed in the clean room, doubling the NanoFab’s capability in e-beam lithography. The new state-of-the-art system offers high resolution exposure capability and accommodates batch handling of substrates. The system is available to users through the NEMO system.
For more information, contact Rich Kasica, 301-975-2693.
New Deep Silicon Etcher System Now Available
The CNST has purchased a new SPTS Omega c2L deep silicon etcher (DSE) which is now available to users in the NanoFab cleanroom. The new DSE can handle up to 200 mm diameter silicon wafer and can etch faster than the current deep silicon etcher in NanoFab. This new DSE also can provide smoother sidewall and better end point detection. This tool can be used to fabricate three-dimensional structures in silicon (Si) with vertical sidewalls of very high aspect ratio (> 50:1). Applications include fabricating micro/nano electro mechanical systems (MEMS/NEMS) such as accelerometers, ink jet heads, pressure sensors, gyroscopes, microphones, microactuators, and lab-on-chip devices.
For additional information, please contact Lei Chen, 301-975-2908.
New Lithography Coater System Now Available
A new Suss Microtec ASC200 Gen 3 automated resist coater has been installed in the NanoFab cleanroom. This system is able to perform spray and spin resist coating with automated wafer handling and resist baking. It is designed to be able to apply high quality resist film on a wide range of substrate shapes, sizes and topologies with consistent and uniform results. This new lithography resist coater is anticipated to enhance the quality, repeatability and throughput of NanoFab precision lithographic imaging.
For more information, contact Liya Yu, 301-975-4590.