Thermal component models are developed for multi-chip IGBT power electronic modules (PEM) and associated high-power converter heatsinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate the electro-thermal performance of high power converter systems. The thermal component models are parameterized in terms of structural and materials parameters so that they can be readily used to develop a library of component models for the various commercially available power modules. The paper presents model development and implementation in SABER, simulation results, and validation using experimental data.
Proceedings Title: Proc., 2002 IEEE Industry Application Society
Conference Dates: October 13-18, 2002
Conference Location: Pittsburgh, PA
Conference Title: IEEE Industrial Applications Society Meeting
Pub Type: Conferences
IGBT, multi-chip power modules, thermal simulation, thermal model