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Displaying 1 - 18 of 18

Deterministic Tagging Technology for Device Authentication

September 16, 2021
Author(s)
Jungjoon Ahn, Joseph J. Kopanski, Yaw S. Obeng, Jihong Kim
This paper discusses the development of a rapid, large-scale integration of deterministic dopant placement technique for encoding information in physical structures at the nanoscale. The doped structures inherit identical and customizable radiofrequency

Live quantification of cell viability via neutral red uptake using lens-free imaging

October 27, 2019
Author(s)
Brian J. Nablo, Jungjoon Ahn, Kiran Bhadriraju, Jong M. Lee, Darwin Reyes-Hernandez
We present the quantification of cell viability during neutral red (NR) uptake with a compact lens-free system utilizing two light sources. Conventionally, the NR uptake assay determines cell viability based on the accumulation of NR within lysosomes and

Probe assisted localized doping of aluminum into silicon substrates

February 20, 2019
Author(s)
Jungjoon Ahn, Santiago D. Solares, Lin You, Hanaul Noh, Joseph Kopanski, Yaw S. Obeng
In this paper, we demonstrate AFM probe assisted deterministic doping (PADD) of Al into an n- type Si (100) wafer, to generate nanoscale counter-doped junctions with a few nanometers depth from Si surface. The local electrical potential changes resulting

Characterization of Buried Interfaces with Scanning Probe Microscopes

May 19, 2016
Author(s)
Joseph J. Kopanski, Lin You, Jungjoon Ahn, Yaw S. Obeng
Scanning probe microscopes (SPMs) have some capability to image sub-surface structure, including the details of buried interfaces. This paper describes the theoretical and practical basis for obtaining information about shallow buried interfaces

Dielectric Spectroscopic Detection of Early Failures in 3-D Integrated Circuits

October 11, 2015
Author(s)
Yaw S. Obeng, Chukwudi A. Okoro, Jungjoon Ahn, Lin You, Joseph J. Kopanski
The commercial introduction of three dimensional integrated circuits (3D-ICs) has been hindered by reliability challenges, such as stress related failures, resistivity changes, and unexplained early failures. In this paper, we discuss a new RF-based

Nanoelectronic Structural Information with Scanning Probe Microscopes

June 14, 2015
Author(s)
Joseph J. Kopanski, Lin You, Jungjoon Ahn, Yaw S. Obeng
Scanning probe microscope (SPM) based methods to obtain subsurface structural information about nano-structured materials are described. A test structure chip containing structures to produce various surface electric field gradients, spatially varying

Electromagnetic Field Test Structure Chip for Back End of the Line Metrology

March 23, 2015
Author(s)
Lin You, Jungjoon Ahn, Emily Hitz, Jonathon Michelson, Yaw S. Obeng, Joseph J. Kopanski
A test chip to produce known and controllable gradients of surface potential and magnetic field at the chip surface and suitable for imaging with various types of scanning probe microscopes is presented. The purpose of the test chip is to evaluate various

Broad-Band Microwave-Based Metrology Platform Development: Demonstration of In-Situ Failure Mode Diagnostic Capabilities for Integrated Circuit Reliability Analyses

November 7, 2014
Author(s)
Lin You, Chukwudi A. Okoro, Jungjoon Ahn, Joseph Kopanski, Yaw S. Obeng, Rhonda R. Franklin
In this paper, we discuss the use of broadband high frequency electromagnetic waves (RF) to non- destructively identify, classify and characterize performance-limiting defects in emerging nanoelectronic devices. As an illustration, the impact of thermal

Scanning Probe Microscopes for Subsurface Imaging

May 11, 2014
Author(s)
Joseph J. Kopanski, Lin You, Jungjoon Ahn, Emily Hitz, Yaw S. Obeng
Scanning probe microscopes (SPMs) have some ability to image sub-surface structures. This paper describes the theoretical and practical basis for imaging metal lines buried beneath insulating layers and for imaging insulating regions or voids within metal

Measurement Science for "More-Than-Moore" Technology Reliability Assessments

October 12, 2012
Author(s)
Chukwudi A. Okoro, Jungjoon Ahn, Meagan V. Kelso, Pavel Kabos, Joseph Kopanski, Yaw S. Obeng
In this paper, we will present an overview of metrology issues and some of the techniques currently under development in our group at NIST, aimed at understanding some of the potential performance limiting issues in such highly integrated systems. We will