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Search Publications by: Kil-Won Moon (Fed)

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Displaying 1 - 25 of 32

Phase Composition and Phase Transformation of Additively Manufactured Nickel Alloy 718 AM Bench Artifacts

February 5, 2024
Author(s)
Fan Zhang, Aaron Johnston-Peck, Lyle E. Levine, Michael Katz, Kil-Won Moon, Maureen E. Williams, Sandra W. Young, Andrew J. Allen, Olaf Borkiewicz, Jan Ilavsky
Additive Manufacturing (AM) technologies offer unprecedented design flexibility but are limited by a lack of understanding of the material microstructure formed under their extreme and transient processing conditions and its subsequent transformation

Developing an Appropriate Heat Treatment Protocol for Additively Manufactured Alloy 718 for Oil and Gas Applications

March 23, 2023
Author(s)
Mark R. Stoudt, James Zuback, Carelyn E. Campbell, Maureen E. Williams, Kil-Won Moon, Carlos R. Beauchamp, Mark Yunovich
The combination of strength, corrosion resistance, and excellent weldability makes Alloy 718 an attractive alloy for additive manufacturing (AM) applications, but the AM build process generates considerable residual stresses, and large compositional and

Development of a Diffusion Mobility Database for Co-based Superalloys

November 27, 2022
Author(s)
Greta Lindwall, Kil-Won Moon, Carelyn E. Campbell, Maureen E. Williams, Whitney Tso
To facilitate the development of high-temperature Co-based - superalloys, a Co-Ni based diffusion mobility database is developed for the eight component FCC (Face Centered Cubic) system of Co-Al-W-Ni-Cr-Ti-Ta-Re. A CALPHAD approach is used to represent

Demonstration of a laser powder bed fusion combinatorial sample for high-throughput microstructure and indentation characterization

August 3, 2021
Author(s)
Jordan Weaver, Adam L. Pintar, Carlos R. Beauchamp, Howard Joress, Kil-Won Moon, Thien Q. Phan
High-throughput experiments that use combinatorial samples with rapid measurements can be used to provide process-structure-property information at reduced time, cost, and effort. Developing these tools and methods is essential in additive manufacturing

Development of Computational Framework for Titanium Alloy Phase Transformation Prediction in Laser Powder-bed Direct Energy Additive Manufacturing

October 16, 2020
Author(s)
Zhi Liang, Ivan Zhirnov, Fan Zhang, Kevontrez K. Jones, David C. Deisenroth, Maureen E. Williams, Ursula R. Kattner, Kil-Won Moon, Wing-Kam Liu, Brandon M. Lane, Carelyn E. Campbell
In conjunction with bare metal single laser track validation experiments, a computational framework is proposed to accelerate the design and development of new additive manufacturing (AM) specific alloys. Specifically, Additive Manufacturing-Computational

Phase Fraction and Evolution of Additively Manufactured 15-5 Stainless Steel and Inconel 625 AM- Benchmark Artifacts

August 5, 2019
Author(s)
Fan Zhang, Lyle E. Levine, Andrew J. Allen, Sandra A. Young, Maureen E. Williams, Mark R. Stoudt, Kil-Won Moon, Jarred C. Heigel, Jan Ilavsky
A proper understanding of the structure and microstructure of additive manufactured (AM) alloys is essential not only to the prediction and assessment of their material properties, but also to the validation and verification of computer models essential to

Solidification of Ni-Re Peritectic Alloys

February 4, 2019
Author(s)
William J. Boettinger, Dale E. Newbury, Nicholas W. Ritchie, Maureen E. Williams, Ursula R. Kattner, Eric Lass, Kil-Won Moon, Michael B. Katz
Differential thermal analysis (DTA) and microstructural and microprobe measurements of DTA and as-cast Ni-Re alloys with compositions between 0.20 and 0.44 mass fraction Re provide information to resolve differences in previously published Ni-Re phase

Diffusion in the Ti-Al-V system

August 23, 2018
Author(s)
Greta Lindwall, Kil-Won Moon, Zhangqi Chen, Michael J. Mengason, Maureen E. Williams, Justin Gorham, Ji-Cheng Zhao, Carelyn E. Campbell
Diffusion in the Ti-Al-V system is studied and a CΑLPHAD diffusion mobility description is developed. Diffusion couple experiments are used to obtain information of Al and V diffusion in the α phase. This includes diffusion paths at the temperatures 923 K

Interdiffusion in the Ni-Re System: Evaluation of Uncertainties

June 23, 2017
Author(s)
William J. Boettinger, Maureen E. Williams, Kil-Won Moon
Diffusion couple experiments between Ni and Re at 1200°C and 1350°C were performed. These experiments established the limits of the two-phase FCC + HCP region. No intermediate phase was observed at these temperatures. Composition dependent interdiffusion

Diffusion in FCC Co-Al-W Alloys at 900 degree C and 1000 degree C

August 17, 2016
Author(s)
Kil-Won Moon, Carelyn E. Campbell, Maureen E. Williams, William J. Boettinger
Diffusion couple experiments between various Co-rich face centered cubic alloys in the Co-W-Al ternary system have been conducted at 900 degree C and 1000 degree C. Diffusion coefficients have been extracted for the Co-W binary and for ternary alloys at

gamma-prime Phase Stability and Phase Equilibrium in Ternary Co-W-Al at 900 degC

October 15, 2014
Author(s)
Eric Lass, Maureen E. Williams, Carelyn E. Campbell, Kil-Won Moon, Ursula R. Kattner
Phase equilibria at 900 °C in the Co-rich Co-W-Al ternary system is investigated through isothermal annealing of six alloy compositions for times up to 8000 h. The volume fraction of the L12-gamma-prime phase co-existing with disordered FCC-gamma, B2 and

Atom-Probe Tomographic Study of ?/?' Interfaces and Compositions in an Aged Co-Al-W Superalloy

December 12, 2012
Author(s)
Eric Lass, Kil-Won Moon, Maureen E. Williams, Carelyn E. Campbell, Ursula R. Kattner, David C. Dunand, Peter J. Bocchini, David N. Seidman
Atom-probe tomography (APT) is utilized to investigate, in a Co-9.7Al-10.8W at.% alloy aged at 900 °C for 1000 h, the phase composition and partitioning behavior of the two-phase ɣ(f.c.c.)/ɣ'(L12) microstructure. The APT composition of the ɣ-matrix (Co-8

Whisker Formation in Pb-Free Surface Finishes

February 2, 2010
Author(s)
Gery R. Stafford, Maureen E. Williams, Jae W. Shin, Kil-Won Moon, William J. Boettinger, Carlos R. Beauchamp
Tin(Sn)-lead(Pb) alloys have been used extensively for surface finishing of electronic components in part because Pb was found to be effective in retarding Sn whisker growth in electrodeposits. Altough whiskers appear to be a local response to the

Alloy Selection

October 16, 2008
Author(s)
C A. Handwerker, Ursula R. Kattner, Kil-Won Moon, J Bath, E -. Bradley, P Snugovsky
In this chapter, the key results and analyses leading to the choice of tin-silver-copper alloys by NEMI as the new national standard Pb-free solder system are discussed in detail. These include data on phase transformations in solders (including melting

Examination of Sn Electrodeposit on a Substrate Not Forming Intermetallic

October 16, 2008
Author(s)
Maureen E. Williams, Kil-Won Moon, William J. Boettinger, Daniel Josell
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To

The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders

October 16, 2008
Author(s)
Kil-Won Moon, Ursula R. Kattner, C A. Handwerker
This paper presents experimental results and theoretical calculations that evaluate the effects of Bi contamination on the solidification behavior of Sn-Pb alloys. The pasty (mushy) range, the type of solidification path, and the microstructure of the

Whisker Formation in Pb-Free Surface Finishes

September 11, 2006
Author(s)
Gery R. Stafford, Maureen E. Williams, C E. Johnson, Kil-Won Moon, Ugo Bertocci, William J. Boettinger
High purity bright Sn, Sn-Cu and Sn-Pb layers measuring 3,7 and 16 microns thick were electrodeposited onto phosphor bronze cantilever beams in a rotating disk apparatus. Beam deflection measurements within 15 min. of plating proved that all

Whisker & Hillock Formation on Sn, Sn-Cu and Sn-Pb Electrodeposits

November 11, 2005
Author(s)
William J. Boettinger, C E. Johnson, Leonid A. Bendersky, Kil-Won Moon, Maureen E. Williams, Gery R. Stafford
Bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 mm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus. Over a period of several days, Sn-Cu deposits develop 50 mm contorted hillocks and 200 mm whiskers, pure Sn

Observed Correlation of Sn Oxide film to Sn Whisker Growth in Sn-Cu electrodeposit for pb-free Solders

September 11, 2005
Author(s)
Kil-Won Moon, C E. Johnson, Maureen E. Williams, O Kongstein, Gery R. Stafford, C A. Handwerker, William J. Boettinger
To evaluate the effects of the oxide film on Sn whisker growth, a bright Sn-Cu electrodeposit was tested in an ultrahigh vacuum chamber with Auger analysis. After Ar+ ion beam cleaning to remove the oxide film, the sample was analyzed and stored in the