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Publications

NIST Authors in Bold

Displaying 301 - 325 of 50441

Formal Methods for Statistical Software

Author(s)
Paul E. Black
"Statistical software" encompasses several distinct classes of software. This report explains what formal methods, tools, and approaches may be able to increase

Role of Firebrand Combustion in Large Outdoor Fire Spread

Author(s)
Samuel L. Manzello, Sayaka Suzuki, Michael Gollner, A C. Fernandez-Pello
Large outdoor fires are an increasing danger to the built environment. Wildfires that spread into com- munities, labeled as Wildland-Urban Interface (WUI) fires

Social and Economic Components of Resilient Multi-Hazard Building Design

Author(s)
Katherine J. Johnson, Juan F. Fung, Siamak Sattar, Christopher L. Segura, Therese P. McAllister, Steven L. McCabe
In 2017, U.S. damages from natural hazard events exceeded $300B, suggesting that current targets for building performance do not sufficiently mitigate loss. The

Calibration

Author(s)
Lane C. Sander
In the context of chemical metrology, calibration is the process of relating a known quantity of an analyte to the corresponding measured instrumental response

Wireless User Requirements for the Factory Workcell

Author(s)
Karl R. Montgomery, Richard Candell, Yongkang Liu, Mohamed T. Hany
Wireless communication is becoming crucial to advanced manufacturing. Industry 4.0 and Smart Manufacturing depend on networked industrial automation systems

Field-Tunable Quantum Disordered Ground State in the Triangular-Lattice Antiferromagnet NaYbO2

Author(s)
Mitchell M. Bordelon, Eric Kenney, Chunxiao Liu, Tom Hogan, Lorenzo Posthuma, Marzieh Kavand, Yuangqi Lyu, Mark Sherwin, Nicholas P. Butch, Craig M. Brown, M. J. Graf, Leon Balents, Stephen D. Wilson
One of the simplest routes to pursuing magnets with strong quantum fluctuations that quench conventional order is via decorating a triangular lattice with

Simulation of Copper Electrodeposition in Through-Hole Vias

Author(s)
Trevor M. Braun, Daniel Josell, Thomas P. Moffat, Jimmy John
Copper electrodeposition processes for filling metallized through-hole (TH) and through-silicon vias (TSV) depend on selective breakdown of a co-adsorbed

Characterizing LTE User Equipment Emissions: Factor Screening

Author(s)
Jason B. Coder, Adam J. Wunderlich, Michael R. Frey, Paul Blanchard, Daniel G. Kuester, Azizollah Kord, Max Lees, Aric W. Sanders, Jolene D. Splett, Lucas N. Koepke, Robert D. Horansky, Duncan A. McGillivray, John M. Ladbury, Jeffrey T. Correia, Venkatesh Ramaswamy, Jerediah Fevold, Shawn Lefebre, Jacob K. Johnson, John Carpenter, Mark Lofquist, Keith Hartley, Melissa M. Midzor
Characterizations of long-term evolution (LTE) user equipment (UE) emissions are a key ingredient in models of interference between wireless cellular networks
Displaying 301 - 325 of 50441