Trevor Braun

Publications

{A high-throughput structural and electrochemical study of metallic glass formation in Ni-Ti-Al

June 4, 2020

Author(s)

Howard L. Joress, Brian L. DeCost, Suchismita Sarker, Trevor M. Braun, Logan T. Ward, Kevin Laws, Apurva Mehta, Jason R. Hattrick-Simpers

Based on a set of machine learning predictions of glass formation in the Ni-Ti-Al system, we have undertaken a high-throughput experimental study of that system

Simulation of Copper Electrodeposition in Through-Hole Vias

October 1, 2019

Author(s)

Trevor M. Braun, Daniel Josell, Thomas P. Moffat, Jimmy John

Copper electrodeposition processes for filling metallized through-hole (TH) and through-silicon vias (TSV) depend on selective breakdown of a co-adsorbed

Exploring the Kinetic and Thermodynamic Relationship of Charge Transfer Reactions used in Localized Electrodeposition and Patterning in a Scanning Bipolar Cell

May 14, 2019

Author(s)

Trevor M. Braun, D. T. Schwartz

Bipolar electrochemistry, defined as simultaneous oxidation and reduction reactions occurring on an electrically floating electrode, involves intricate coupling

Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias

January 18, 2019

Author(s)

Trevor Braun, Daniel Josell, Manoj R. Silva, Thomas P. Moffat

This work examines Cu deposition in low chloride, suppressor containing electrolytes that exhibit a transition from passive to active deposition partway down

Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

May 16, 2018

Author(s)

Trevor Braun, Daniel Josell, Thomas P. Moffat, Hyo Jong Lee, SH Kim

This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO4 + NiCl2 + H3BO3 electrolyte containing a branched polyethyleneimine

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Trevor Braun (Assoc)

Publications