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David Raciti, Trevor Braun, Brian M. Tackett, Heng Xu, Mutya Cruz, Benjamin Wiley, Thomas P. Moffat
An interconnected network of high-aspect ratio Ag nanowires was pressed against porous gas diffusion layers (both conductive or non-conductive) to use as a gas
Howard L. Joress, Brian L. DeCost, Suchismita Sarker, Trevor M. Braun, Logan T. Ward, Kevin Laws, Apurva Mehta, Jason R. Hattrick-Simpers
Based on a set of machine learning predictions of glass formation in the Ni-Ti-Al system, we have undertaken a high-throughput experimental study of that system
Trevor M. Braun, Daniel Josell, Thomas P. Moffat, Jimmy John
Copper electrodeposition processes for filling metallized through-hole (TH) and through-silicon vias (TSV) depend on selective breakdown of a co-adsorbed
Bipolar electrochemistry, defined as simultaneous oxidation and reduction reactions occurring on an electrically floating electrode, involves intricate coupling
Trevor Braun, Daniel Josell, Manoj R. Silva, Thomas P. Moffat
This work examines Cu deposition in low chloride, suppressor containing electrolytes that exhibit a transition from passive to active deposition partway down