The successful development of a collaboratory for Telepresence Microscopy (TPM) provides an important new tool to promote technology transfer in the areas of measurement technology. NIST and Texas Instruments (TI), under the auspices of the National Automated Manufacturing Testbed (NAMT) and in collaboration with the University of Illinois (UIC) and Argonne National Laboratory (ANL) have developed a collaboratory testbed to demonstrate the value of TPM within organizations having a large distributed manufacturing facility such as Texas Instruments and between scientific research organizations such as NIST, ANL, and UIC. Large distributed manufacturing sites such as TI need rapid response when problems threaten to disrupt multi-million dollar production facilities. This is particularly important when expertise needed to solve the problem or instrumentation is not locally present. The resulting delays are inevitable and often costly. Telepresence minimizes these delays.
Proceedings Title: Proceedings of SPIE, Metrology, Inspection, and Process Control for Microlithography XIII, Bhanwar Singh, Editor
Conference Dates: March 15, 1999
Conference Location: Santa Clara, CA
Conference Title: New Technology/New Approaches To Metrology
Pub Type: Conferences
analytical, collaboratory, internet, scanning electron microscope, telepresence, transmission electron microscope