We have developed a technique utilizing a capacitance measurement for the accurate determination of the out-of-plane expansion of thin films on the order of 1 micrometer thick. This is important because the coefficient of thermal expansion (CTE) is a key parameter for the design and reliability of polymer containing products. Due to the drive towards denser packages and the use of thin polymeric films as inner-layer dielectrics (ILDs), a technique is required that can make precision measurements of the CTE of thin films. The current technique, thermomechanical analysis (TMA), has been demonstrated by a multi-user round-robin test to be inadequate for such measurements. The absolute measurement technique that we have developed is based upon a parallel plate three-terminal guarded electrode.
Proceedings Title: Characterization and Metrology for ULSI Technology: 1998 International Conference
Conference Dates: March 23-27, 1998
Conference Title: AIP Conference Proceedings
Pub Type: Conferences
absolute measurement, capacitance, coefficient of thermal expansion, swelling, thin film, z-axis expansion