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Microtomography of an integrated circuit interconnect with an electromigration void

Published

Author(s)

Zachary H. Levine, A R. Kalukin, M Kuhn, S P. Frigo, I McNulty, C C. Retsch, Ying-ju Wang, Uwe Arp, Thomas B. Lucatorto, B D. Ravel, Charles S. Tarrio
Citation
Journal of Applied Physics
Volume
87

Citation

Levine, Z. , Kalukin, A. , Kuhn, M. , Frigo, S. , McNulty, I. , Retsch, C. , Wang, Y. , Arp, U. , Lucatorto, T. , Ravel, B. and Tarrio, C. (2000), Microtomography of an integrated circuit interconnect with an electromigration void, Journal of Applied Physics (Accessed April 23, 2024)
Created January 1, 2000, Updated February 17, 2017