Test Structures for the extraction of Electrical Critical Dimensions (ECD) and having all-copper features with no barrier metal films have been fabricated. The advantage of this approach is that electrical measurements provide a non-destructive method for determining CD values and enable fundamental studies of electron transport in narrow copper features unaffected by the complications of barrier-metal films. This paper reports on the results of various tests which have been conducted to fully evaluate the current design.
Proceedings Title: 2007 International Conference on Microlectronic Test Structures
Conference Dates: March 19-22, 2007
Conference Location: Tokyo, JA
Pub Type: Conferences
barrier metal, CD, copper, Integrated circuit, interconnect, metrology, Test Structure