The demand for miniaturization in the microelectronics industry requires that the RC (Resistance-Capacitance) factor be lowered to reduce interconnection delay, crosstalk and power loss. The most promising way to achieve this is by introducing porosity into the dielectric film material. We show that laser-generated surface acoustic waves can successfully and rapidly characterize porosity/density and stiffness of these films. Complementary measurements from X-ray reflectivity and Brillouin light scattering verify our results. We discuss why nanoindentation presents difficulties.
Proceedings Title: Review of Progress in Quantitative Nondestructive Evaluation | | Review of Progress in Quantitative Nondestructive Evaluation, Volume 22 | AIP
Conference Dates: July 14-19, 2002
Conference Title: AIP Conference Proceedings
Pub Type: Conferences
laser ultrasonics, low K materials, porous films