Current extreme ultraviolet (EUV) photoresist materials do not yet meet requirements on exposure-dose sensitivity, line-width roughness (LWR), and resolution. Fundamental studies are required to quantify the trade-offs in materials properties and processing steps for EUV photoresist specific problems such as high photoacid generator (PAG) loadings and the use of very thin films. Furthermore, new processing strategies such as changes in the developer strength and composition may enable increased resolution. In this work, model photoresists are used to investigate the influence of photoacid generator loading and developer strength effects on EUV lithographically printed images. Measurements of line width roughness and developed line-space patterns were performed.
Proceedings Title: Proceedings of SPIE
Conference Dates: February 25-March 2, 2007
Conference Location: San Jose, CA
Conference Title: SPIE Advanced Lithography
Pub Type: Conferences
chemically amplified phoresists, diffusion, neutron reflectivity, photolithographty, swelling