An increasing number of technologies demand nanoporous materials with vastly improved physical, mechanical and thermal properties. This manuscript develops the microstructural basis for synthesizing organosilicate glasses (OSGs) with unprecedented thermal, mechanical, and physical properties. OSGs are traditionally synthesized by cross-linking alkyltrifunctionalsilanes (SiOxRH where R is an organic group) into a rigid glass. The critical insight is to bias this reaction to form small cyclic and cage type silsesquioxane precursors that remain soluble in the reaction solution and can later be covalently incorporated into the final cross-linked network.This is accomplished by copolymerizing methyltrimethoxysilane with an ethylene-bridged pair of trimethoxysilanes, leading to an unparalleled 6-fold increase in elastic modulus, a 4-fold increase in hardness, and 20-fold decrease of the thermal expansion coefficient. These vastly superior mechanical and thermal properties are discussed in the context of next generation semiconductor devices.
Citation: Advanced Materials
Pub Type: Journals
hardness, low-k dielectric, modulus, nanoindentation, organosilicate, porosity, thin film, x-ray porosimetry