A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES

Published

December 7, 2009

Author(s)

Richard A. Allen, Winthrop A. Baylies, Paul Langer, Ralph Danzl, Frank W. DelRio, Gavin Horn, Roy Knechtel, Michael Mattes, David T. Read, Sumant Sood, Kevin T. Turner

Abstract

An international round robin was organized to update SEMI Standard MS5: Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures. Results from the round robin allowed for inclusion of a Precision and Bias statement. The new version of MS5 shows that between-laboratory reproducibility was 152%, while the within laboratory repeatability was 111%. Since no Reference Materials exist for this method, no bias statement can be made at this time. In addition to including precision and bias, the test procedure was re-written for clarity and the analysis procedure was updated to allow for a wider range of geometry.

Conference Dates

December 6-8, 2009

Conference Location

Grenoble

Conference Title

Procedings of the Conference on Wafer Bonding for Microsystems and Wafer Level Integration

Pub Type

Conferences

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Keywords

Microelectromechanical Systems, MEMS, Wafer Bond, Metrology

Citation

Allen, R. , Baylies, W. , Langer, P. , Danzl, R. , DelRio, F. , Horn, G. , Knechtel, R. , Mattes, M. , Read, D. , Sood, S. and Turner, K. (2009), A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES, Procedings of the Conference on Wafer Bonding for Microsystems and Wafer Level Integration, Grenoble, -1, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=904232 (Accessed April 19, 2024)