The fabrication of top metal contacts for organic electronics represents a challenge and has important consequences for electrical properties of such systems. We report a low cost and non-destructive printing process, Flip Chip Lamination (FCL), to fabricate top contacts on rubrene single crystals on flexible plastic substrates. Surface chemistry treatments using fluorinated self-assembled monolayers combined with moderate heat and pressure allow conformal lamination of gold contacts onto rubrene single crystals. I-V characteristics of rubrene with FCL top contact and bottom bonded contacts suggests better quality at the interface compared to the analogue architecture of e-beam evaporated top contacts.
Citation: Applied Physics Letters
Pub Type: Journals
organic electronics, flip-chip lamination, electronic contacts, organic-inorganic interface