An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
The ABM contact aligner allows users to align patterns on the front or back of a substrate and to print feature sizes down to 800 nm. The tool offers vacuum
The ADT 7132 dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 4 mm thick and supports sizes
The AllWin21 Downstream plasma asher uses heat and exposure to downstream oxygen radicals to remove resist and other organic materials. The cassette load system
The ASML PAS 5500/275D is a high throughput i-line stepper. It utilizes 5X reduction and projection capability with step and repeat to transfer photomask
The Oxford FlexAL atomic layer deposition (ALD) system supports plasma and thermal ALD coating processes with precise ultrathin and pinhole free films. The
The Bruker Dektak XT contact profilometer measures the thin film thickness of patterned features by sensing the deflection of a fine stylus that is raster
The Envirco 1.8 m laminar hood provides soft lithography lab users a clean environment to perform final assembly processes on PDMS samples. The hood is capable
The Arradiance Gemstar atomic layer deposition (ALD) system supports thermal ALD coating processes with precise ultrathin and pinhole free films in a compact
The Harrick Plasma PDC-32 plasma bonder is used to remove fine particles on user substrates prior to release agent treatment and to modify the surface bonds of
The Lattice Gear LatticeAx cleaving tool is used for highly accurate, manual cleaving of substrates. The system is an indenting and cleaving tool that produces
The CorSolutions microfluidic test station consists of a digital microscope, PneuWave pneumatic pump, and microfluidic probes to enable non-destructive, rapid
The microwave plasma system is used for photoresist descum/removal and wafer cleaning. The system is equipped with a hand free door opening system for easy
The Nikon SMZ1500 is a long working distance stereo microscope that supports both reflected light and transmitted light modes for inspecting substrates and
The Olympus SZH10 is a long working distance stereo microscope that supports both reflected light and transmitted light modes for inspecting substrates and
The CNST NanoFab PDMS casting station consists of a Hamilton Safeaire fume hood which houses a Smart Coater 100 spinner, a Dataplate digital hot plate, an Ohaus
The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to high temperature furnace processing. The
The Unaxis 790 reactive ion etcher (RIE) is a general purpose parallel plate plasma etching system which uses ionized fluorocarbon gases and oxygen to etch
This PlasmaTherm 790 reactive ion etcher (RIE) is a parallel plate plasma etching system which uses fluorocarbon and oxygen gases to etch silicon nitride thin
The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to processing in high temperature furnaces
The Reynolds Tech silicon etch wet bench uses dilute potassium hydroxide (KOH) to preferentially etch silicon along the material's crystal planes. The process
The Rigaku SmartLab X-ray diffraction system (XRD) is a fully automated, modular system for advanced x-ray diffraction measurements on a wide range of materials
The Semitool PSC-101 spin rinse dryer uses deionized water to rinse and heated nitrogen to dry whole wafer substrates automatically after wet chemical processes
The Denton “Bench Top Turbo” thermal evaporator is a single source evaporator equipped with substrate rotation, a thickness monitor, and automatic deposition
The Tousimis Supercritical Autosamdri-815 Series B critical point dryer utilizes liquid carbon dioxide (LCO 2) to dry substrates in a controlled manner in order
The Suss MicroTec SB6e wafer bonder is a universal vacuum substrate bonder for designed for a wide range of microelectromechanical system (MEMS) applications