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NanoFab Tool: Suss MicroTec SB6e Wafer Bonder

suss_wafer_bonder

The Suss MicroTec SB6e wafer bonder is a universal vacuum substrate bonder for designed for a wide range of microelectromechanical system (MEMS) applications. Prior to bonding, substrate stacks can be mechanically clamped using a transport fixture or temporarily bonded by adhesion film. The transport fixture also fits into the Suss MA6 mask aligner, allowing users to precisely pre-align their substrates before bonding.

Specifications/Capabilities

  • Minimum chamber vacuum: 5 x 10-3 Pa (5 x 10-8 bar).
  • Maximum temperature: 500 °C.
  • Bonding force range on a 150 mm wafer: 20 kN to 300 N.
  • High voltage power supply for anodic bonding.
  • Supported bonding methods: anodic, adhesive, fusion, eutectic, and glass frit.
  • Aligned bonding support for whole wafers on MA6.
  • Transport fixture for bonded whole wafers is compatible with the NanoFab's Suss MA6 mask aligner.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 150 mm (6 in).
  • Small pieces supported: Yes.
  • MA6 aligned wafer diameters supported: 75 mm (3 in), 100 mm (4 in), and 150 mm (6 in).
  • Maximum thickness: 10 mm.

Typical Applications

  • Biofluidic devices.
  • Thermal sensors.
  • MEMS processing.
Created June 6, 2014, Updated December 4, 2019