The Suss MicroTec SB6e wafer bonder is a universal vacuum substrate bonder for designed for a wide range of microelectromechanical system (MEMS) applications. Prior to bonding, substrate stacks can be mechanically clamped using a transport fixture or temporarily bonded by adhesion film. The transport fixture also fits into the Suss MA6 mask aligner, allowing users to precisely pre-align their substrates before bonding.