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NanoFab Tool: Suss MicroTec MA6/BA6 Contact Aligner
The Suss MicroTec MA6 contact aligner allows users to align patterns on the front or back of a substrate and to print feature sizes down to 1 µm. The tool offers a variety of exposure methods with overlay accuracy better than 500 nm. It can accommodate substrates ranging from 150 mm diameter wafers down to small pieces.
Specifications/Capabilities
- Exposure methods: flood, proximity, soft, hard, low vacuum and vacuum contacts.
- Exposure wavelengths:
- UV broadband (350 nm to 450 nm).
- I-line (365 nm band-pass filter).
- G-line (436 nm band-pass filter).
- Illumination area: 150 mm diameter.
- Resolution: 1 µm.
- Overlay accuracy: = 500 nm.
- Front and back side pattern alignment.
Usage Information
Supported Sample Sizes
- Maximum wafer diameter: 150 mm (6 in).
- Small pieces supported: Yes.
- Maximum substrate thickness: 6 mm.
- Mask sizes supported:
- 63 mm x 63 mm.
- 102 mm x 102 mm.
- 127 mm x 127 mm.
- 178 mm x 178 mm.
Typical Applications
- Medical devices.
- Biofluidic devices.
- Microelectromechanical systems.
- Thermal sensors.
- Printing micrometer size and larger features.
Created May 6, 2014, Updated February 24, 2023