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NanoFab Tool: Suss MicroTec MA6/BA6 Contact Aligner

Photograph of the Suss MicroTec MA6/BA6 Contact Aligner System.

The Suss MicroTec MA6 contact aligner allows users to align patterns on the front or back of a substrate and to print feature sizes down to 1 µm. The tool offers a variety of exposure methods with overlay accuracy better than 500 nm. It can accommodate substrates ranging from 150 mm diameter wafers down to small pieces.

Specifications/Capabilities

  • Exposure methods: flood, proximity, soft, hard, low vacuum and vacuum contacts.
  • Exposure wavelengths:
    • UV broadband (350 nm to 450 nm).
    • I-line (365 nm band-pass filter).
    • G-line (436 nm band-pass filter).
  • Illumination area: 150 mm diameter.
  • Resolution: 1 µm.
  • Overlay accuracy: = 500 nm.
  • Front and back side pattern alignment.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 150 mm (6 in).
  • Small pieces supported: Yes.
  • Maximum substrate thickness: 6 mm.
  • Mask sizes supported:
    • 63 mm x 63 mm.
    • 102 mm x 102 mm.
    • 127 mm x 127 mm.
    • 178 mm x 178 mm.

Typical Applications

  • Medical devices.
  • Biofluidic devices.
  • Microelectromechanical systems.
  • Thermal sensors.
  • Printing micrometer size and larger features.
Created May 6, 2014, Updated November 21, 2019