CHIPS for America Awards

The CHIPS investment will enable Corning to increase production of High Purity Fused Silica (HPFS) and EXTREME ULE Glass (Ultra Low Expansion Glass) and scale a novel technology manufacturing process in Canton.

The CHIPS for America award will provide Micron New York up to $4.6 billion in total direct funding under the CHIPS and Science Act to support construction of the first two fabs of planned four fab “megafab” focused on leading-edge DRAM chip production. Each fab will have 600,000 square feet of cleanrooms, totaling 2.4 million square feet of cleanroom space across the four facilities—the largest amount of cleanroom space ever announced in the United States and the size of nearly 40 football fields.

The CHIPS for America award will provide GlobalFoundries up to $1.45 billion in total direct funding under the CHIPS and Science Act to support the construction of a new, large-scale 300mm fabrication facility, the expansion and modernization of an existing fabrication facility, and the expansion of existing campus to provide advanced packaging technology not currently available in the U.S. It will also support the expansion of the existing Malta, New York fabrication facility, which includes a strategic agreement with General Motors, that is expected to secure a dedicated supply of essential semiconductor technologies.

This CHIPS investment will help ensure a reliable domestic supply of important equipment needed for semiconductor manufacturing. This would be a meaningful step towards strengthening U.S. economic and national security, as currently, there is no domestic production of semiconductor-grade dry vacuum pumps.

The CHIPS for America award will provide Intel Ohio up to $1.5 billion in total direct funding under the CHIPS and Science Act to support the creation of a new regional chipmaking ecosystem, anchored by a new leading-edge logic fab which will produce the Intel 14A node and other future Intel nodes and expand leading-edge foundry capacity.

The CHIPS for America award will provide HP up to $53 million in total direct funding under the CHIPS and Science Act to support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (“R&D”) activities to commercial manufacturing operations.

The CHIPS for America award will provide Intel Oregon up to $1.86 billion in total direct funding under the CHIPS and Science Act to support the investment in the premier hub of leading-edge research and development in the United States through the expansion and modernization of technology development facilities that will utilize the world’s first commercial High-NA EUV lithography equipment.

Develop a reference implementation of the Commercial Trust™ Protocol (CTP) to manage verifiable credentials (VCs), metrology, and intellectual property, enhancing hardware security, and provenance tracking of microelectronic components across supply chains. This project will benefit the U.S. microelectronics supply chain industry.

The CHIPS for America investment would support the construction of a new, state-of-the-art advanced test and packaging facility focused on meeting the increasing demand for InP PICs.

Develop new high-speed nanoprobes to enhance the ability for semiconductor failure analysis to locate and analyze to detect "soft" electrical faults that occur on the most advanced semiconductors and are otherwise difficult to detect. This project will benefit researchers and semiconductor failure analysis engineers in the U.S. semiconductor industry.

The CHIPS for America award will provide Samsung Austin, Texas up to $4.745 billion in total direct funding under the CHIPS and Science Act to support the construction of a comprehensive advanced manufacturing ecosystem that includes both high volume leading-edge logic manufacturing and dedicated space for R&D and will transform the small municipality of Taylor into an expansive hub of leading-edge semiconductor manufacturing. This ecosystem would include two leading-edge logic foundry fabs focused on mass production of 2nm process technologies and an R&D lab dedicated to research and development of manufacturing process nodes at least several generations ahead of the current one in production.

Develop AI-powered software to automate chip design optimization for manufacturability through accelerated lithography simulation. This project will benefit U.S. researchers and industry involve in semiconductor design and manufacturing.

The CHIPS for America award will provide Texas Instruments Sherman, Texas up to $900 million in total direct funding under the CHIPS and Science Act to support the construction of two new, large-scale 300-mm fabrication facilities that are expected to produce 65nm – 130nm analog and embedded processing semiconductors, with anticipated production capacity of tens of millions chips every day. The Sherman site is one of the only greenfield production sites for current-generation and mature-node chips on 300-mm wafers in the U.S.

The CHIPS for America award will provide GlobaWafers with $380 million in direct funding under the CHIPS and Science Act to support the construction of a 300mm silicon wafer manufacturing facility for all chips, including leading-edge, mature-node, and memory chips.

The CHIPS for America award will provide Samsung Austin, Texas up to $4.745 billion in total direct funding under the CHIPS and Science Act to support the expansion of a facility that has been an economic engine for Central Texas for nearly 30 years. This investment would expand the existing facilities to support the production of leading fully depleted silicon-on-insulator (FD-SOI) process technologies for critical U.S. industries, including aerospace, defense, and automotive. This investment also includes commitments to collaborate with the U.S. Department of Defense.