TY  - JOUR
AU  - Trevor Braun
AU  - Daniel Josell
AU  - Thomas P. Moffat
C2  - Electrochimica Acta
DA  - 2021-02-15 05:02:00
LA  - en
PB  - Electrochimica Acta
PY  - 2021
TI  - Simulating Cu Electrodeposition in High Aspect Ratio Features: Effect of Control Mode and Uncompensated Resistance in S-NDR Systems
ER  -