TY  - JOUR
AU  - Thomas P. Moffat
AU  - Daniel Wheeler
AU  - Soo Kim
AU  - Daniel Josell
C2  - Electrochimica Acta
DA  - 2008-10-16 14:10:19
LA  - en
PB  - Electrochimica Acta
PY  - 2008
TI  - Curvature Enhanced Adsorbate Coverage Mechanism for Bottom-Up Superfilling and Bump Control in Damascene Processing
ER  -