TY  - JOUR
AU  - Roger Marks
AU  - Dylan Williams
C2  - International Journal of Microelectronics and Electronic Packaging
DA  - 1996-08-01
LA  - en
M1  - 18
PB  - International Journal of Microelectronics and Electronic Packaging
PY  - 1996
TI  - Electrical characterization methods for high-speed interconnections
ER  -