TY  - CONF
AU  - Ryan Birringer
AU  - Roey Shaviv
AU  - Thomas Mountsier
AU  - Jon Reid
AU  - Jian Zhou
AU  - Roy Geiss
AU  - David Read
AU  - Reinhold Dauskardt
C2  - Advanced Metallization Conference Proceedings 2009, Baltimore, MD, US
DA  - 2009-10-13 00:10:00
LA  - en
PB  - Advanced Metallization Conference Proceedings 2009, Baltimore, MD, US
PY  - 2009
TI  - Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films
ER  -