TY  - JOUR
AU  - Chukwudi Okoro
AU  - Yaw Obeng
C2  - Microelectronics Reliability
DA  - 2012-03-19 00:03:00
LA  - en
PB  - Microelectronics Reliability
PY  - 2012
TI  - A Case Study on the Impact of Local Material Chemistry on the Mechanical Reliability of Packaged Integrated Circuits: Correlation of the Packaging Fallout to the Chemistry of Passivation Dielectrics in an Al-Cu System
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=909379
ER  -