TY  - CONF
AU  - Jan Obrzut
AU  - A Anopchenko
AU  - K Kano
AU  - Haonan Wang
C2  - Materials, Integration and Packaging Issues for High-Frequency Devices, Symposium B| | Materials, Integration and Packaging Issues for High-Frequency Devices|Materials Research Society, Undefined
DA  - 2003-11-01 00:11:00
LA  - en
M1  - 783
PB  - Materials, Integration and Packaging Issues for High-Frequency Devices, Symposium B| | Materials, Integration and Packaging Issues for High-Frequency Devices|Materials Research Society, Undefined
PY  - 2003
TI  - High Frequency Loss Mechanism in Polymers Filled With Dielectric Modifiers
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852273
ER  -