TY  - JOUR
AU  - Ryan Birringer
AU  - Roey Shaviv
AU  - Roy Geiss
AU  - David Read
AU  - Reinhold Dauskardt
C2  - Microelectronic Engineering
DA  - 2011-08-15 00:08:00
DO  - https://doi.org/10.1063/1.3624659
LA  - en
M1  - 110
PB  - Microelectronic Engineering
PY  - 2011
TI  - Effects of barrier composition and electroplating chemistry on adhesion and voiding in copper/dielectric diffusion barrier films
ER  -