TY  - CONF
AU  - Pucic, S.
C2  - Proc.,  IEEE Instrum. Meas. Tech. Conf., Irvine, CA
DA  - 1993-05-01 00:05:00
LA  - en
PB  - Proc.,  IEEE Instrum. Meas. Tech. Conf., Irvine, CA
PY  - 1993
TI  - Diffusion of Copper into Gold Plating
ER  -