TY  - CONF
AU  - J Rodriguez
AU  - John Reichl
AU  - Zharadeen Parrilla
AU  - Allen Hefner Jr.
AU  - David Berning
AU  - M Velez-Reyes
AU  - Jih-Sheng Lai
C2  - Proc., 2002 IEEE Industry Application Society, Pittsburgh, PA, USA
DA  - 2002-10-24 00:10:00
LA  - en
PB  - Proc., 2002 IEEE Industry Application Society, Pittsburgh, PA, USA
PY  - 2002
TI  - Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=30113
ER  -