TY  - CONF
AU  - Y. Kantor
AU  - Michael Janezic
AU  - Pavel Kabos
AU  - Billy Riddle
AU  - James Baker-Jarvis
C2  - Intl. Microelectronics and Packaging Soc., Denver, CO
DA  - 2001-03-26 00:03:00
LA  - en
PB  - Intl. Microelectronics and Packaging Soc., Denver, CO
PY  - 2001
TI  - Dielectric Properties of Materials for Packaging from 1 to 60 GHz
ER  -